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AssigneeNorthwestern University
InventorsChad A. Mirkin, Wooyoung Shim, Adam B. Braunschweig, Xing Liao, Jinan Chai, Jong Kuk Lim, Gengfeng Zheng, Zijian Zheng
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Disclosed are methods of lithography using a tip array having a plurality of pens attached to a backing layer, where the tips can comprise a metal, metalloid, and/or semi-conducting material, and the backing layer can comprise an elastomeric polymer. The tip array can be used to perform a lithography process in which the tips are coated with an ink (e.g., a patterning composition) that is deposited onto a substrate upon contact of the tip with the substrate surface. The tips can be easily leveled onto a substrate and the leveling can be monitored optically by a change in light reflection of the backing layer and/or near the vicinity of the tips upon contact of the tip to the substrate surface.
A tip array comprising a plurality of tips fixed to an elastomeric backing layer, the tips comprising a metal, a metalloid (optionally silicon), a semi-conducting material, or a combination thereof, and each tip having a radius of curvature of less than 1 μm.
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Dependencies are inferred from the claim text.