Dual cure adhesive formulations
AssigneeLord Corporation
InventorMark W. Pressley
Life of this patent
Estimating the term…
Abstract
An adhesive composition comprising as principal components, a polymerizable component, an ambient temperature radical polymerization catalyst system and a photoinitiator. The adhesive may optionally comprise an adhesion promoter, a toughener, an epoxy, and a filler material. Further, a two-part reactive adhesive comprising, a first part comprising, (i) at least one free radical-polymerizable monomer, (ii) at least one reducing agent, and (iii) a photoinitiator, and a second part comprising an oxidizing agent that is reactive at ambient temperature with the reducing agent to produce free radicals that are capable of initiating and propagating free radical polymerization.
Claims24
-24. (canceled)
A method of forming a hem flange assembly, comprising the steps of:
- (a) positioning a first panel adjacent to a second panel such that an edge of the second panel extends beyond an edge of the first panel;
- (b) folding the non-overlapping portion of the second panel over the edge of the first panel to form a hem flange joint;
- (c) applying an over hem sealer to cover the hem flange joint, the over hem sealer comprising:
- (i) at least one free-radical polymerizable monomer;
- (ii) an ambient temperature radical initiator system comprising at least one oxidizing agent and at least one reducing agent;
- (iii) a photoinitiator;
- and,
- (iv) an epoxy compound;
- wherein the adhesive will at least partially cure at a temperature between 10° C. and 40° C. through the ambient temperature radical catalyst system;
- (d) allowing the ambient temperature cure to take place, wherein at least a portion of the surface of the sealer remains uncured and slightly tacky;
- and
- (e) curing the surface of the sealer by exposing the surface to electromagnetic energy to activate the photoinitiator.
(canceled)
Dependencies are inferred from the claim text.