Printed matter manufacturing method, printed matter manufacturing device, and printed matter
AssigneeSeiko Epson Corporation
InventorsKeigo SUGAI, Seigo MOMOSE
Life of this patent
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Abstract
The printed matter manufacturing method includes the steps of providing a printed layer in a predetermined pattern on a substrate, and providing an open part penetrating through the substrate and the printed layer in an open part formation region. The printed matter manufacturing method has a step of providing a buffer layer for mitigating a shock imparted to the printed layer when the open part is provided, so that the buffer layer contacts the printed layer in at least a portion of a periphery of the open part formation region.
Claims18
A printed matter manufacturing method comprising:
- forming a printed layer in a predetermined pattern on a substrate;
- forming an open part penetrating through the substrate and the printed layer in an open part formation region of the printed layer;
- and
- forming a buffer layer for mitigating a shock imparted to the printed layer by formation of the open part, so that the buffer layer contacts the printed layer in at least a portion of a periphery of the open part formation region.
A printed matter manufacturing device for manufacturing a printed matter in which an open part penetrating through a substrate and a printed layer is formed in an open part formation region of the printed layer, the printed matter manufacturing device comprising:
- a film formation device configured and arranged to form the printed layer in a predetermined pattern on the substrate;
- and
- a control device configured to control the film formation device to form a buffer layer for mitigating a shock imparted to the printed layer by formation of the open part, so that the buffer layer contacts the printed layer in at least a portion of a periphery of the open part formation region.
A printed matter comprising:
- a substrate;
- a printed layer formed on a substrate;
- an open part penetrating through the substrate and the printed layer in an open part formation region of the printed layer;
- and
- a buffer layer contacting the printed layer in at least a portion of a periphery of the open part formation region to mitigate a shock imparted to the printed layer by formation of the open part.
A printed matter manufacturing method comprising:
- forming a printed layer on a substrate;
- forming an open part penetrating through the substrate and the printed layer;
- and
- forming a buffer layer for mitigating a shock imparted to the printed layer by formation of the open part, so that the buffer layer contacts an entire surface on one side of the printed layer.
A printed matter manufacturing device for manufacturing a printed matter in which an open part penetrating through a substrate and a printed layer is formed, the printed matter manufacturing device comprising:
- a film formation device configured and arranged to form the printed layer on the substrate;
- and
- a control device configured to control the film formation device to form a buffer layer for mitigating a shock imparted to the printed layer by formation of the open part, so that the buffer layer contacts an entire surface on one side of the printed layer.
A printed matter comprising:
- a substrate;
- a printed layer formed on a substrate;
- an open part penetrating through the substrate and the printed layer;
- and
- a buffer layer contacting an entire surface on one side of the printed layer to mitigate a shock imparted to the printed layer by formation of the open part.
Dependencies are inferred from the claim text.