Plasma processing apparatus and plasma processing method
AssigneeMitsubishi Heavy Industries, Ltd.
InventorsRyuichi Matsuda, Kazuto Yoshida, Yuichi Kawano
Life of this patent
Estimating the term…
Loading patent…
AssigneeMitsubishi Heavy Industries, Ltd.
InventorsRyuichi Matsuda, Kazuto Yoshida, Yuichi Kawano
Estimating the term…
Provided are a plasma processing apparatus and a plasma processing method wherein particles generated due to the inner potential of an inner cylinder disposed inside of a vacuum container are reduced. The plasma processing apparatus has, inside of a metal vacuum chamber (11), the inner cylinder (15) composed of a surface-alumited aluminum, disposes a substrate in a plasma diffusion region, and performs plasma processing. A plurality of protruding portions (15a) in point-contact with the vacuum chamber (11) are provided on the lower end portion of the inner cylinder (15), the alumite film (16) on the leading end portion (15b) of each of the protruding portion (15a) is removed, and the inner cylinder and the vacuum chamber (11) are electrically connected to each other.
A plasma processing apparatus which includes an inner tube made of aluminum having an anodized surface inside a metal vacuum chamber and in which plasma processing is performed with a substrate disposed in a plasma diffusion region, wherein part of anodized aluminum in a surface of the inner tube is removed, so that the inner tube is electrically conductive with the vacuum chamber.
A plasma processing method comprising the steps of:
Dependencies are inferred from the claim text.