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US 2012/0103155 A1Published application
Methods and apparatus for cutting profiles
AssigneeSeoul Laser Dieboard System Co., Ltd.
InventorSang Moo Lee
Life of this patent
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Abstract
A device, comprising: a base plate configured to be moveable toward and back from a metal rule having at least one flanged side, wherein the metal rule is fed into the device along a metal rule feeding path; a first plate coupled to the base plate, the first plate including a plurality of cutter holes formed on its surface; a plurality of cutting elements configured to engage the corresponding plurality of cutter holes on the first plate to make cuts on the at least one flanged side of the metal rule.
Claims15
A device, comprising:
- a base plate configured to be moveable toward and back from a metal rule having at least one flanged side,
- wherein said metal rule is fed into the device along a metal rule feeding path;
- a first plate coupled to said base plate, said first plate including a plurality of cutter holes formed on its surface;
- a plurality of cutting elements configured to engage the corresponding plurality of cutter holes on said first plate to make cuts on the at least one flanged side of the metal rule.
1 more element
Dependencies are inferred from the claim text.