Photosensitive modified polyimide resin composition and use thereof

A photosensitive modified polyimide resin composition, which comprises a modified polyimide represented by the following Formula (I):

• (wherein each R independently represents a C1-C18 alkylene group;
• each X independently represents a carbonate group, ester group or urethane group;
• each Y independently represents a C1-C18 alkylene group or arylene group;
• A represents a divalent organic group which is the part of a diamine other than the amino groups thereof;
• Z and Z′ represent a tetravalent organic group which is the part of a tetracarboxylic acid other than the carboxyl groups thereof;
• at least one of A, Z and Z′ has a free hydroxyl group(s) and/or carboxyl group(s);
• and m, p and q each independently represents an integer of 1 to 20);
• a photosensitizer;
• and a heat curing agent.