# US 2012/0074576 A1 · Interconnect for an optoelectronic device

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- Number: US 2012/0074576 A1
- Document ID: US20120074576A1
- Status: Published application
- Kind: A1
- Application number: 12/893,765
- Filed: 2010-09-29
- Published: 2012-03-29
- Earliest claimed: 2010-09-29
- Assignees: SunPower Corporation
- Inventors: Ryan Linderman; Keith Johnston; Thomas Phu; Matthew Dawson
- Web page: https://patentgrep.com/patent/US20120074576A1

## CPC

- H10F 19/90: Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers (between thin-film photovoltaic cells on a single substrate H10F19/35)
- H10F 19/70: comprising bypass diodes (bypass diodes in a junction box H02S40/34)
- H10F 19/80: Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
- H10F 19/902: {for series or parallel connection of photovoltaic cells}
- H10F 19/904: {characterised by the shapes of the structures}
- H10F 19/908: {for back-contact photovoltaic cells}
- H10F 77/60: Arrangements for cooling, heating, ventilating or compensating for temperature fluctuations
- H10F 77/63: Arrangements for cooling directly associated or integrated with photovoltaic cells, e.g. heat sinks directly associated with the photovoltaic cells or integrated Peltier elements for active cooling
- H10W 70/411: {Chip-supporting parts, e.g. die pads}
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- Y02E 10/50: Photovoltaic [PV] energy
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION

## Abstract

Interconnects for optoelectronic devices are described. An interconnect may include a stress relief feature. An interconnect may include an L-shaped feature.

## Claims

### Claim 1

An interconnect for an optoelectronic device, the interconnect comprising:
an interconnect body comprising an inner surface, an outer surface, a first end, and a second end;
a plurality of bond pads coupled to the inner surface of the interconnect body, between the first and second ends; and
a stress relief feature formed in the interconnect body, the stress relief feature comprising a plurality of T-shaped slots, each T-shaped slot approximately aligned with a corresponding one of the plurality of bond pads, the vertical portion of each T-shaped slot proximate to the corresponding one of the plurality of bond pads, and the horizontal portion of each T-shaped slot distal from the corresponding one of the plurality of bond pads.

### Claim 2 (depends on 1)

The interconnect of claim 1, wherein the stress relief feature further comprises a narrow slot in a location approximately equally between the first and second ends, the narrow slot comprising an opening at the inner surface of the interconnect body and extending into the interconnect body, but not through to the outer surface.

### Claim 3 (depends on 1)

The interconnect of claim 1, wherein the stress relief feature further comprises a first narrow slot in a location proximate to the first end and distal from the second end, the first narrow slot comprising an opening at the outer surface of the interconnect body and extending into the interconnect body, but not through to the inner surface, and a second narrow slot between the first narrow slot and the first end, the second narrow slot between and orthogonal to the inner and outer surfaces, but not opening into either of the inner and outer surfaces, and the second narrow slot coupled to the horizontal portion of an outer-most T-shaped slot of the plurality of T-shaped slots.

### Claim 4 (depends on 1)

The interconnect of claim 1, wherein the stress relief feature further comprises a vertical jog near to or at the location where one of the plurality of bond pads is coupled to the inner surface of the interconnect body.

### Claim 5 (depends on 1)

The interconnect of claim 1, wherein the stress relief further feature comprises:
a first narrow slot in a location approximately equally between the first and second ends, the first narrow slot comprising an opening at the inner surface of the interconnect body and extending into the interconnect body, but not through to the outer surface;
a second narrow slot in a location proximate to the first end and distal from the second end, the second narrow slot comprising an opening at the outer surface of the interconnect body and extending into the interconnect body, but not through to the inner surface;
a third narrow slot between the second narrow slot and the first end, the third narrow slot between and orthogonal to the inner and outer surfaces, but not opening into either of the inner and outer surfaces, and the third narrow slot coupled to the horizontal portion of an outer-most T-shaped slot of the plurality of T-shaped slots; and
a vertical jog near to or at the location where one of the plurality of bond pads is coupled to the inner surface of the interconnect body.

### Claim 6 (depends on 1)

The interconnect of claim 1, wherein the interconnect is a coupling interconnect.

### Claim 7 (depends on 1)

The interconnect of claim 1, wherein the interconnect is a terminal interconnect.

### Claim 8

An interconnect for an optoelectronic device, the interconnect comprising:
an interconnect body comprising an inner surface, an outer surface, a first end, and a second end;
a plurality of bond pads coupled to the inner surface of the interconnect body, between the first and second ends; and
a feature formed in the interconnect body, the feature comprising a first L-shaped extension at the first end of the interconnect body and a second L-shaped extension at the second end of the interconnect body, the horizontal bases of each of the first and second L-shaped extensions proximate to the inner surface and distal from the outer surface of the interconnect body.

### Claim 9 (depends on 8)

The interconnect of claim 8, further comprising:
a stress relief feature comprising a narrow slot in a location approximately equally between the first and second ends, the narrow slot comprising an opening at the inner surface of the interconnect body and extending into the interconnect body, but not through to the outer surface.

### Claim 10 (depends on 8)

The interconnect of claim 8, further comprising:
a stress relief feature further comprising a vertical jog near to or at the location where one of the plurality of bond pads is coupled to the inner surface of the interconnect body.

### Claim 11 (depends on 8)

The interconnect of claim 8, further comprising a stress relief feature, the stress relief feature comprising:
a narrow slot in a location approximately equally between the first and second ends, the narrow slot comprising an opening at the inner surface of the interconnect body and extending into the interconnect body, but not through to the outer surface; and
a vertical jog near to or at the location where one of the plurality of bond pads is coupled to the inner surface of the interconnect body.

### Claim 12 (depends on 8)

The interconnect of claim 8, wherein the interconnect is a coupling interconnect.

### Claim 13 (depends on 8)

The interconnect of claim 8, wherein the interconnect is a terminal interconnect.

### Claim 14

An interconnect for an optoelectronic device, the interconnect comprising:
an interconnect body comprising an inner surface, an outer surface, a first end, and a second end;
a plurality of bond pads coupled to the inner surface of the interconnect body, between the first and second ends;
a stress relief feature formed in the interconnect body, the stress relief feature comprising a plurality of T-shaped slots, each T-shaped slot approximately aligned with a corresponding one of the plurality of bond pads, the vertical portion of each T-shaped slot proximate to the corresponding one of the plurality of bond pads, and the horizontal portion of each T-shaped slot distal from the corresponding one of the plurality of bond pads;
a first L-shaped extension at the first end of the interconnect body; and
a second L-shaped extension at the second end of the interconnect body, the horizontal bases of each of the first and second L-shaped extensions proximate to the inner surface and distal from the outer surface of the interconnect body.

### Claim 15 (depends on 14)

The interconnect of claim 14, wherein the stress relief feature further comprises a narrow slot in a location approximately equally between the first and second ends, the narrow slot comprising an opening at the inner surface of the interconnect body and extending into the interconnect body, but not through to the outer surface.

### Claim 16 (depends on 14)

The interconnect of claim 14, wherein the stress relief feature further comprises a first narrow slot in a location proximate to the first end and distal from the second end, the first narrow slot comprising an opening at the outer surface of the interconnect body and extending into the interconnect body, but not through to the inner surface, and a second narrow slot between the first narrow slot and the first end, the second narrow slot between and orthogonal to the inner and outer surfaces, but not opening into either of the inner and outer surfaces, and the second narrow slot coupled to the horizontal portion of an outer-most T-shaped slot of the plurality of T-shaped slots.

### Claim 17 (depends on 14)

The interconnect of claim 14, wherein the stress relief feature further comprises a vertical jog near to or at the location where one of the plurality of bond pads is coupled to the inner surface of the interconnect body.

### Claim 18 (depends on 14)

The interconnect of claim 14, wherein the stress relief feature further comprises:
a first narrow slot in a location approximately equally between the first and second ends, the first narrow slot comprising an opening at the inner surface of the interconnect body and extending into the interconnect body, but not through to the outer surface;
a second narrow slot in a location proximate to the first end and distal from the second end, the second narrow slot comprising an opening at the outer surface of the interconnect body and extending into the interconnect body, but not through to the inner surface;
a third narrow slot between the second narrow slot and the first end, the third narrow slot between and orthogonal to the inner and outer surfaces, but not opening into either of the inner and outer surfaces, and the third narrow slot coupled to the horizontal portion of an outer-most T-shaped slot of the plurality of T-shaped slots; and
a vertical jog near to or at the location where one of the plurality of bond pads is coupled to the inner surface of the interconnect body.

### Claim 19 (depends on 14)

The interconnect of claim 14, wherein the interconnect is a coupling interconnect.

### Claim 20 (depends on 14)

The interconnect of claim 14, wherein the interconnect is a terminal interconnect.