# US 2012/0074554 A1 · Bond ring for a first and second substrate

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- Number: US 2012/0074554 A1
- Document ID: US20120074554A1
- Status: Published application
- Kind: A1
- Application number: 12/891,062
- Filed: 2010-09-27
- Published: 2012-03-29
- Earliest claimed: 2010-09-27
- Assignees: Taiwan Semiconductor Manufacturing Company, Ltd.
- Inventors: Chun-Wen Cheng; Hsueh-An Yang
- Web page: https://patentgrep.com/patent/US20120074554A1

## CPC

- B81C 1/00269: {Bonding of solid lids or wafers to the substrate}
- B81C 1/0038: {Processes for creating layers of materials not provided for in groups B81C1/00357 - B81C1/00373}
- H10W 76/10: Containers or parts thereof
- B81C 2203/0118: Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
- B81C 2203/019: characterised by the material or arrangement of seals between parts
- B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

The present disclosure provides a device having a plurality of bonded substrates. The substrates are bonded by a first bond ring and a second bond ring. In an embodiment, the first bond ring is a eutectic bond and the second bond ring is at least one of an organic material and a eutectic bond. The second bond ring encircles the first bond ring. The first bond ring provides a hermetic region of the device. In a further embodiment, a plurality of wafers are bonded which include a third bond ring disposed at the periphery of the wafers.

## Claims

### Claim 1

A device, comprising:
a first substrate including a MEMS device; and
a second substrate bonded to the first substrate, wherein the second substrate is bonded to the first substrate at a first bond ring and a second bond ring.

### Claim 2 (depends on 1)

The device of claim 1, further comprising:
a third bond ring encircling the first and second bond rings.

### Claim 3 (depends on 2)

The device of claim 2, wherein the third bond ring includes the same material as the second bond ring.

### Claim 4 (depends on 1)

The device of claim 1, wherein the first bond ring provides a hermetic region of the MEMS device.

### Claim 5 (depends on 1)

The device of claim 1, wherein the first bond ring is a eutectic bond.

### Claim 6 (depends on 1)

The device of claim 1, wherein the second bond ring is a eutectic bond.

### Claim 7 (depends on 1)

The device of claim 1, wherein the eutectic bond includes a material selected from the group consisting of germanium, aluminum, gold, and silicon.

### Claim 8 (depends on 1)

The device of claim 1, wherein the first bond ring is a first eutectic bond and the second bond ring is a second eutectic bond, and wherein the first and second eutectic bond include at least one different material.

### Claim 9 (depends on 1)

The device of claim 1, wherein the second bond ring includes an organic material.

### Claim 10 (depends on 9)

The device of claim 9, wherein the organic material is polyimide.

### Claim 11 (depends on 1)

The device of claim 1, wherein the second bond ring is adjacent to and encircles the first bond ring.

### Claim 12 (depends on 1)

The device of claim 1, wherein the first substrate is a first wafer including a MEMS device and the second substrate is a second wafer including a device fabricated using a CMOS-based process.

### Claim 13 (depends on 12)

The device of claim 12, wherein the first wafer and the second wafer include a third bond ring, wherein the third bond ring is disposed at the periphery of the first wafer and the second wafer.

### Claim 14

A device, comprising:
a first wafer; and
a second wafer, wherein the first wafer and the second wafer are bonded together using at least one bond ring, wherein the at least one bond ring is disposed on the peripheral region on the first wafer and the second wafer.

### Claim 15 (depends on 14)

The device of claim 14, wherein the at least one bond ring includes an organic material.

### Claim 16 (depends on 15)

The device of claim 15, wherein the organic material is polyimide.

### Claim 17 (depends on 14)

The device of claim 14, wherein the at least one bond ring is a eutectic bond.

### Claim 18

A method, comprising:
providing a first substrate, wherein the first substrate includes a MEMS device;
providing a second substrate;
bonding the first substrate to the second substrate, wherein the bonding includes:
forming a first bond ring; and
forming a second bond ring, wherein the second bond ring encircles the first bond ring.

### Claim 19 (depends on 18)

The method of claim 18, wherein the forming the first bond ring includes forming a eutectic bond and forming the second bond ring includes forming a ring of organic material.

### Claim 20 (depends on 18)

The method of claim 18, wherein the forming the first bond ring includes forming a first eutectic bond and forming the second bond ring includes forming a second eutectic bond.