# US 2012/0074547 A1 · Integrated circuit packaging system with lead encapsulation and method of manufacture thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2012/0074547 A1 - Document ID: US20120074547A1 - Status: Published application - Kind: A1 - Application number: 12/890,409 - Filed: 2010-09-24 - Published: 2012-03-29 - Earliest claimed: 2010-09-24 - Assignees: STATS ChipPAC, Ltd. - Inventors: Byung Tai Do; Reza Argenty Pagaila; Linda Pei Ee Chua; Arnel Senosa Trasporto - Web page: https://patentgrep.com/patent/US20120074547A1 ## CPC - H10W 70/042: {Etching} - H10W 70/411: {Chip-supporting parts, e.g. die pads} - H10W 70/421: {Shapes or dispositions} - H10W 70/424: {Cross-sectional shapes (H10W70/481 takes precedence)} - H10W 70/457: {of metallic layers on leadframes} - H10W 70/681: {comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage} - H10W 72/075: {of bond wires} - H10W 72/354: {comprising polymers} - H10W 72/884: {Die-attach connectors and bond wires} - H10W 72/952: {comprising metals or metalloids, e.g. PbSn, Ag or Cu} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 74/111: {the semiconductor body being completely enclosed} - H10W 90/726: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A method of manufacture of an integrated circuit packaging system includes: forming a package paddle; forming a lead adjacent the package paddle, the lead having a hole in a lead body top side and a lead ridge protruding from a lead non-horizontal side; mounting an integrated circuit over the package paddle; connecting an electrical connector to the lead and the integrated circuit; and forming a fill layer within the hole. ## Claims ### Claim 1 A method of manufacture of an integrated circuit packaging system comprising: forming a package paddle; forming a lead adjacent the package paddle, the lead having a hole in a lead body top side and a lead ridge protruding from a lead non-horizontal side; mounting an integrated circuit over the package paddle; connecting an electrical connector to the lead and the integrated circuit; and forming a fill layer within the hole. ### Claim 2 (depends on 1) The method as claimed in claim 1 wherein forming the lead includes forming the lead having a conductive lead top layer with the hole therethrough. ### Claim 3 (depends on 1) The method as claimed in claim 1 wherein forming the fill layer includes forming the fill layer coplanar with a conductive lead bottom layer of the lead. ### Claim 4 (depends on 1) The method as claimed in claim 1 wherein forming the package paddle includes forming the package paddle having a paddle recess with the integrated circuit mounted within the paddle recess. ### Claim 5 (depends on 1) The method as claimed in claim 1 wherein forming the lead includes forming the lead having a conductive lead bottom layer and the hole at a bottom layer periphery of the conductive lead bottom layer. ### Claim 6 A method of manufacture of an integrated circuit packaging system comprising: forming a package paddle; forming a lead adjacent the package paddle, the lead having a hole in a lead body top side and a lead ridge protruding from a lead non-horizontal side; attaching an attach layer to the package paddle; mounting an integrated circuit over the package paddle with the attach layer attached to the integrated circuit; connecting an electrical connector to the lead and the integrated circuit; and forming a fill layer within the hole. ### Claim 7 (depends on 6) The method as claimed in claim 6 wherein forming the fill layer includes forming a passivation layer within the hole. ### Claim 8 (depends on 6) The method as claimed in claim 6 wherein forming the lead includes forming the lead having a lower step in the hole and an inner surface at a lower end of the hole. ### Claim 9 (depends on 6) The method as claimed in claim 6 wherein forming the lead includes forming the lead having a lower step in the hole and an open lower end of the hole. ### Claim 10 (depends on 6) The method as claimed in claim 6 wherein forming the lead includes forming the lead having a top opening of the hole smaller than a bottom opening of the hole. ### Claim 11 An integrated circuit packaging system comprising: a package paddle; a lead adjacent the package paddle, the lead having a hole in a lead body top side and a lead ridge protruding from a lead non-horizontal side; an integrated circuit over the package paddle; an electrical connector connected to the lead and the integrated circuit; and a fill layer within the hole. ### Claim 12 (depends on 11) The system as claimed in claim 11 wherein the lead includes a conductive lead top layer with the hole therethrough. ### Claim 13 (depends on 11) The system as claimed in claim 11 wherein the fill layer is coplanar with a conductive lead bottom layer of the lead. ### Claim 14 (depends on 11) The system as claimed in claim 11 wherein the package paddle includes a paddle recess with the integrated circuit mounted within the paddle recess. ### Claim 15 (depends on 11) The system as claimed in claim 11 wherein the lead includes a conductive lead bottom layer and the hole at a bottom layer periphery of the conductive lead bottom layer. ### Claim 16 (depends on 11) The system as claimed in claim 11 further comprising: an attach layer attached to the package paddle; and wherein: the integrated circuit over the package paddle with the attach layer attached to the integrated circuit. ### Claim 17 (depends on 16) The system as claimed in claim 16 wherein the fill layer is a passivation layer within the hole. ### Claim 18 (depends on 16) The system as claimed in claim 16 wherein the lead includes a lower step in the hole and an inner surface at a lower end of the hole. ### Claim 19 (depends on 16) The system as claimed in claim 16 wherein the lead includes a lower step in the hole and an open lower end of the hole. ### Claim 20 (depends on 16) The system as claimed in claim 16 wherein the lead includes a top opening of the hole smaller than a bottom opening of the hole.