# US 2012/0074527 A1 · Integrated circuit comprising a device with a vertical mobile element integrated in a support substrate and method for producing the device with a mobile element > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2012/0074527 A1 - Document ID: US20120074527A1 - Status: Published application - Kind: A1 - Application number: 13/230,035 - Filed: 2011-09-12 - Published: 2012-03-29 - Earliest claimed: 2010-09-10 - Assignees: Commissariat A L'energie Atomique Et Aux Energies Alternatives; STMicroelectronics (Crolles 2) SAS; STMicroelectronics S.r.l. - Inventors: Fabrice Casset; Lionel Cadix; Perceval Coudrain; Alexis Farcy; Laúrent-Lüc Chapelon; Yacine Felk; Pascal Ancey - Web page: https://patentgrep.com/patent/US20120074527A1 ## CPC - B81C 1/00246: {Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on the same substrate} - B81C 1/005: {Bulk micromachining} - G01P 15/125: by capacitive pick-up - H03H 3/0073: {Integration with other electronic structures} - H03H 9/2426: {in combination with other electronic elements} - B81B 2201/014: having a cantilever fixed on one side connected to one or more dimples - B81B 2201/0235: Accelerometers - B81B 2201/0271: Resonators; ultrasonic resonators - B81B 2203/0353: Holes - B81B 2207/012: the micromechanical device and the control or processing electronics being separate parts in the same package - G01P 2015/082: {for two degrees of freedom of movement of a single mass} - B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01) - G01P: MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT (measuring or recording blood flow A61B5/02, A61B8/06; monitoring speed or deceleration of electrically-propelled vehicles B60L3/00; vehicle lighting systems adapted to indicate speed B60Q1/54; determining position or course in navigation, measuring ground distance in geodesy or surveying G01C; combined measuring devices for measuring two or more variables of movement G01C23/00; measuring velocity of sound G01H; measuring velocity of light G01J7/00; measuring direction or velocity of solid objects by reception or emission of radiowaves or other waves and based on propagation effects, e.g. Doppler effect, propagation time, direction of propagation, G01S; measuring speed of nuclear radiation G01T; measuring acceleration of gravity G01V; {measuring or recording the speed of trains B61L23/00; speed indicators incorporated in motor vehicles B60K35/00; measuring frequency or phase G01R; traffic control G08G}) - H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P) - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) ## Abstract The integrated circuit comprises a support substrate having opposite first and second main surfaces. A cavity passes through the support substrate and connects the first and second main surfaces. The integrated circuit comprises a device with a mobile element, the mobile element and a pair of associated electrodes of which are included in a cavity. An anchoring node of the mobile element is located at the level of the first main surface. The integrated circuit comprises a first elementary chip arranged at the level of the first main surface and electrically connected to the device with a mobile element. ## Claims ### Claim 1 An integrated circuit comprising: a support substrate provided with opposite first and second main surfaces, a cavity passing through the support substrate from one of the main surface to the opposite main surface, a device with a mobile element formed in said support substrate, wherein the mobile element is included in the cavity, the mobile element having an anchoring node on the first main surface and a maximum displacement area, the anchoring node and the maximum displacement area defining an axis substantially perpendicular to the first and second main surfaces, at least one elementary chip arranged on one of the main surfaces and adapted to be electrically linked to the device with a mobile element. ### Claim 2 (depends on 1) The device according to claim 1, comprising an actuating circuitry of the mobile element included in the cavity. ### Claim 3 (depends on 2) The device according to claim 2, wherein the actuating circuitry is configured to perform electrostatic actuation and comprises a first electrode overlapping a second electrode, one of the electrodes being arranged on the mobile element. ### Claim 4 (depends on 1) The device according to claim 1, comprising a second anchoring node of the mobile element on the second main surface. ### Claim 5 (depends on 1) The device according to claim 1, wherein the at least one elementary chip is formed in the support substrate made from semi-conductor material. ### Claim 6 (depends on 1) The device according to claim 1, wherein the chip comprises an electric connection passing through the support substrate, the electric connection being electrically linked to the device with a mobile element. ### Claim 7 A method for producing a device with a mobile element comprising a mobile element and an electrode, comprising the successive steps: forming an etching mask simultaneously delineating the patterns of the electrode and of the mobile element on a main surface of a support substrate, forming a hole representative of the electrode and a hole representative of the mobile element in the support substrate, from the etching mask, forming the future mobile element and electrode in the support substrate, releasing the mobile element. ### Claim 8 (depends on 7) The method according to claim 7, wherein the etching mask comprises the pattern of a pair of electrodes. ### Claim 9 (depends on 7) The method according to claim 7, wherein an embedment point of the mobile element is made, after forming the mobile element. ### Claim 10 (depends on 7) The method according to claim 7, wherein the etching mask comprises the pattern of an electric connection between opposite first and second main surfaces of a support substrate, the electric connection passing through the support substrate. ### Claim 11 (depends on 7) The method according to claim 7, comprising thinning of the support substrate to uncover a part of the mobile element and of the electrode. ### Claim 12 (depends on 7) The method according to claim 7, wherein the hole representative of the electrode and the hole representative of the mobile element pass through the support substrate. ### Claim 13 (depends on 7) The method according to claim 7, wherein forming the future mobile element and electrode in the support substrate is performed by depositing an electrically conducting material.