# US 2012/0074126 A1 · Wafer profile modification through hot/cold temperature zones on pedestal for semiconductor manufacturing equipment > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2012/0074126 A1 - Document ID: US20120074126A1 - Status: Published application - Kind: A1 - Application number: 13/072,546 - Filed: 2011-03-25 - Published: 2012-03-29 - Earliest claimed: 2010-03-26 - Assignees: Applied Materials, Inc. - Inventors: Won B. Bang; Tien Fak Tan; Son M. Phi; Dmitry Lubomirsky - Web page: https://patentgrep.com/patent/US20120074126A1 ## CPC - H10P 72/7624: {characterised by the mechanical construction of the susceptor, stage or support} - H10P 72/0434: {mainly by convection} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A substrate support comprising a top ceramic plate providing a substrate support surface for supporting a substrate during substrate processing, a substrate pedestal having coolant channels formed therein and a thermoelectric deck sandwiched between the top ceramic plate and substrate pedestal. The thermoelectric deck includes a plurality of embedded thermoelectric elements that can either heat or cool the substrate support surface. ## Claims ### Claim 1 A substrate support comprising: a top ceramic plate providing a substrate support surface for supporting a substrate during substrate processing; an substrate pedestal having fluid channels formed therein; a thermoelectric deck sandwiched between the top ceramic plate and substrate pedestal, the thermoelectric deck having a plurality of thermoelectric elements embedded therein that can either heat or cool the substrate support surface. ### Claim 2 (depends on 1) The substrate support of claim 1 wherein the thermoelectric elements are arranged and operatively coupled to provide independent temperature control in at least two different zones of the substrate support surface with each zone having at least one temperature sensor associated with it. ### Claim 3 (depends on 2) The substrate support of claim 2 wherein at least two different zones includes a first inner zone and a second zone that surrounds and is concentric with the inner zone. ### Claim 4 (depends on 1) The substrate support of claim 1 wherein the thermoelectric elements are operatively coupled to provide independent temperature control in at least four different zones of the substrate support surface with each zone having at least one temperature sensor associated with it. ### Claim 5 (depends on 4) The substrate support of claim 4 wherein the at least four different zones include a first inner zone and a plurality of equally sized outer zone that, when taken together, surround and are concentric with the inner zone. ### Claim 6 (depends on 1) The substrate support of claim 1 further comprising a heat exchanger operatively coupled to the substrate pedestal to circulate a cooling liquid through the coolant channels in the pedestal. ### Claim 7 (depends on 1) The substrate support of claim 1 wherein the thermoelectric elements comprise peltier elements. ### Claim 8 (depends on 1) The substrate support of claim 1 wherein the thermoelectric elements are sandwiched between upper and lower layers of a thermal interface material. ### Claim 9 (depends on 6) The substrate support of claim 6 wherein the thermal interface material comprises a silicon pad. ### Claim 10 (depends on 8) The substrate support of claim 8 wherein the upper and lower layers of thermal interface material are each between 10-20 mils thick. ### Claim 11 (depends on 8) The substrate support of claim 8 wherein the thermal interface material is a thermally conductive, electrically insulative material. ### Claim 12 (depends on 2) The substrate support of claim 2 wherein the thermoelectric deck comprises a base plate positioned above and attached to a thermoelectric deck cover. ### Claim 13 (depends on 12) The substrate support of claim 12 wherein the base plate and thermoelectric deck cover are each made from an aluminum alloy. ### Claim 14 (depends on 12) The substrate support of claim 12 wherein the aluminum base plate comprises grooves formed at its upper surface in a pattern that improves thermal isolation of the at least two independently controlled temperature zones. ### Claim 15 A substrate support comprising: a top ceramic plate providing a substrate support surface for supporting a substrate during substrate processing; an substrate pedestal having fluid channels formed therein, the fluid channels adapted to circulate a heat transfer fluid through the pedestal as a primary mechanism to control a temperature of the substrate support surface; a thermoelectric deck sandwiched between the top ceramic plate and substrate pedestal, the thermoelectric deck having a base plate, a deck cover, and a plurality of thermoelectric elements positioned between the base plate and the deck cover arranged in at least two independently controlled temperature zones with each independently controlled temperature zone including a temperature sensor, wherein in each independently controlled temperature zone the thermoelectric deck can either heat or cool the substrate support surface in that zone in response to readings from temperature sensor associated with the zone thereby providing a secondary mechanism to adjust the temperature of the substrate support surface set primarily by circulating a heat transfer medium through the fluid channels. ### Claim 16 (depends on 15) The substrate support set forth in claim 15 wherein the thermoelectric deck allows for the adjustment of temperature across the substrate support surface at a resolution and rate that cannot otherwise be achieved by circulation of the fluid heat transfer medium alone. ### Claim 17 (depends on 16) The substrate support of claim 16 wherein the thermoelectric elements are arranged and operatively coupled to provide independent temperature control in at least two different zones of the substrate support surface including a first inner zone and a second zone that surrounds and is concentric with the inner zone. ### Claim 18 (depends on 16) The substrate support of claim 16 wherein the thermoelectric elements are operatively coupled to provide independent temperature control in at least four different zones of the substrate support surface including a first inner zone and a plurality of equally sized outer zone that, when taken together, surround and are concentric with the inner zone.