# US 2012/0073980 A1 · Iridium plating solution and method of plating using the same

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- Number: US 2012/0073980 A1
- Document ID: US20120073980A1
- Status: Published application
- Kind: A1
- Application number: 12/893,454
- Filed: 2010-09-29
- Published: 2012-03-29
- Earliest claimed: 2010-09-29
- Inventors: MASAHIRO ITO
- Web page: https://patentgrep.com/patent/US20120073980A1

## CPC

- C25D 3/52: characterised by the organic bath constituents used
- C25D 3/567: {containing more than 50% by weight of platinum group metals}
- C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR

## Abstract

Proposed are an iridium plating solution capable of easily forming an iridium plating coat in which the occurrence of cracks is suppressed as much as possible and an iridium plating method. In the present invention, the iridium plating solution uses an iridium compound obtained by adding, to an iridium (III) complex salt containing a halogen as an anionic component, one or more compounds selected from the following group and by stirring the resulting mixture, the group consisting of a saturated monocarboxylic acid, a saturated monocarboxylic acid salt, a saturated dicarboxylic acid, a saturated dicarboxylic acid salt, a saturated hydroxycarboxylic acid, a saturated hydroxycarboxylic acid salt, an amide and urea, wherein the iridium plating solution includes at least one or more of Fe, Co, Ni and Cu.

## Claims

### Claim 1

An iridium plating solution using an iridium compound obtained by adding, to an iridium (III) complex salt containing a halogen as an anionic component, one or more compounds selected from a following group and by stirring a resulting mixture, the group consisting of a saturated monocarboxylic acid, a saturated monocarboxylic acid salt, a saturated dicarboxylic acid, a saturated dicarboxylic acid salt, a saturated hydroxycarboxylic acid, a saturated hydroxycarboxylic acid salt, an amide and urea, wherein the iridium plating solution comprises at least one or more of Fe, Co, Ni and Cu.

### Claim 2 (depends on 1)

The iridium plating solution according to claim 1, wherein the content of at least one or more of Fe, Co, Ni and Cu is 0.01 g/L to 10 g/L.

### Claim 3 (depends on 1)

An iridium plating method wherein the plating solution according to claim 1 is used, and plating is performed under the conditions that the pH is 1 to 8, the temperature is 50 to 98° C. and the current density is 0.01 to 3.0 A/dm2.

### Claim 4 (depends on 2)

An iridium plating method wherein the plating solution according to claim 2 is used, and plating is performed under the conditions that the pH is 1 to 8, the temperature is 50 to 98° C. and the current density is 0.01 to 3.0 A/dm2.