# US 2012/0073977 A1 · Plating apparatus and plating method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2012/0073977 A1 - Document ID: US20120073977A1 - Status: Published application - Kind: A1 - Application number: 13/307,906 - Filed: 2011-11-30 - Published: 2012-03-29 - Earliest claimed: 2006-01-30 - Assignees: Ibiden Co., Ltd. - Inventors: Yasuaki TACHI; Shigeki Sawa; Toshiyuki Kasuga - Web page: https://patentgrep.com/patent/US20120073977A1 ## CPC - H05K 3/241: {characterised by the electroplating method; means therefor, e.g. baths or apparatus} - C25D 7/0614: {Strips or foils} - C25D 17/02: Tanks; Installations therefor - C25D 17/12: Shape or form (C25D17/14 takes precedence) - H05K 3/423: {characterised by electroplating method} - H05K 1/0393: {Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups)} - H05K 2201/0394: Conductor crossing over a hole in the substrate or a gap between two separate substrate parts - H05K 2201/09563: Metal filled via - H05K 2203/0143: Using a roller; Specific shape thereof; Providing locally adhesive portions thereon - H05K 2203/1545: Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR ## Abstract A method for plating a belt substrate including conveying a belt substrate through a plating tank, contacting an immersed cathode power-supply device and/or an auxiliary cathode power-supply device with the belt substrate conveyed into the interior of the plating tank such that the belt substrate becomes a cathode, and electrically plating a surface of the belt substrate in the interior of the plating tank while the immersed cathode power-supply device and/or the auxiliary cathode power-supply device maintains cathode power-supply to the belt substrate conveyed into the interior portion of the plating tank. The immersed cathode power-supply device and the auxiliary cathode power-supply device are positioned in the interior portion of the plating tank and are electrically connected by a short circuit wiring. ## Claims ### Claim 1 A method for plating a belt substrate, comprising: conveying a belt substrate through a plating tank; contacting at least one of an immersed cathode power-supply device and an auxiliary cathode power-supply device with the belt substrate conveyed into an interior portion of the plating tank such that the belt substrate becomes a cathode; and electrically plating a surface of the belt substrate in the interior portion of the plating tank while at least one of the immersed cathode power-supply device and the auxiliary cathode power-supply device maintains cathode power-supply to the belt substrate conveyed into the interior portion of the plating tank, wherein the immersed cathode power-supply device and the auxiliary cathode power-supply device are positioned in the interior portion of the plating tank and are electrically connected by a short circuit wiring device. ### Claim 2 (depends on 1) A method for plating a belt substrate according to claim 1, wherein the belt substrate is conveyed by a conveyor device configured to carry the belt substrate through the interior portion of the plating tank. ### Claim 3 (depends on 1) A method for plating a belt substrate according to claim 1, wherein the immersed cathode power-supply device and the auxiliary cathode power-supply device are positioned such that at least one of the immersed cathode power-supply device and the auxiliary cathode power-supply device maintains tension of the belt substrate carried by a conveyor device configured to carry the belt substrate through the interior portion of the plating tank. ### Claim 4 (depends on 1) A method for plating a belt substrate according to claim 1, wherein the immersed cathode power-supply device and the auxiliary cathode power-supply device are positioned on a non-plating surface side of the belt substrate inside the plating tank. ### Claim 5 (depends on 1) A method for plating a belt substrate according to claim 1, wherein the immersed cathode power-supply device and the auxiliary cathode power-supply device are positioned offset from a plurality of anodes such that the immersed cathode power-supply device and the auxiliary cathode power-supply device do not face the anodes provided within the interior portion of the plating tank. ### Claim 6 (depends on 1) A method for plating a belt substrate according to claim 1, wherein the plating tank comprises a main tank, a plurality of anodes positioned in the main tank, and an auxiliary tank communicated with the main tank through a slit configured to pass the belt substrate, and the immersed cathode power-supply device and the auxiliary cathode power-supply device are positioned in the auxiliary tank. ### Claim 7 (depends on 1) A method for plating a belt substrate according to claim 1, wherein the immersed cathode power-supply device comprises a conductive roller, and the auxiliary cathode power-supply device comprises a conductive roller. ### Claim 8 (depends on 1) A method for plating a belt substrate according to claim 1, wherein one of the immersed cathode power-supply device and the auxiliary cathode power-supply device comprises a drive roller configured to convey the belt substrate, and the other one of the immersed cathode power-supply device and the auxiliary cathode power-supply device comprises a dependent roller configured to rotate according to the drive roller. ### Claim 9 (depends on 1) A method for plating a belt substrate according to claim 1, wherein the immersed cathode power-supply device comprises a conductive roller, the auxiliary cathode power-supply device comprises a conductive roller, and the immersed cathode power-supply device and the auxiliary cathode power-supply device are positioned relative to an insulative roller such that at least one of the immersed cathode power-supply device and the auxiliary cathode power-supply device maintains tension of the belt substrate carried by a conveyor device configured to carry the belt substrate through the interior portion of the plating tank.