# US 2012/0073129 A1 · Multilayer ceramic electronic component and a method for manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2012/0073129 A1 - Document ID: US20120073129A1 - Status: Published application - Kind: A1 - Application number: 13/241,863 - Filed: 2011-09-23 - Published: 2012-03-29 - Earliest claimed: 2010-09-28 - Assignees: Murata Manufacturing Co., Ltd. - Inventors: Tomoro ABE; Masato NISHIOKA - Web page: https://patentgrep.com/patent/US20120073129A1 ## CPC - H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor - H01G 4/08: Inorganic dielectrics - H01G 4/30: Stacked capacitors (H01G4/33 takes precedence) - Y10T 29/49117: Conductor or circuit manufacturing - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract In a method of manufacturing a multilayer ceramic electronic component, polishing is performed so that intersection lines extending from external surfaces of a green element body and interfaces between a green chip to be formed into a laminate portion and ceramic side surface layers are each located within a curved-surface formation range of a chamfer portion. Accordingly, since a green ceramic material is extended so as to fill the interfaces like so-called “putty”, and the adhesive strength between the green chip to be formed into the laminate portion and each of the ceramic side surface layers is increased. ## Claims ### Claim 1 A method for manufacturing a multilayer ceramic electronic component comprising the steps of: forming an element body including a pair of principal surfaces facing each other, a pair of side surfaces facing each other, and a pair of end surfaces facing each other, rounded chamfer portions arranged along ridgelines between the side surfaces and the end surfaces, and a plurality of ceramic layers extending in a principal surface direction and laminated in a direction perpendicular or substantially perpendicular thereto and a plurality of pairs of internal electrodes which are formed along interfaces between the ceramic layers, which each include an exposure end exposed to one of the pair of end surfaces, and which are not exposed to the side surfaces; and forming external electrodes at least on the pair of end surfaces of the element body so as to be electrically connected to the exposure ends of the internal electrodes; wherein the step of forming an element body includes the steps of: preparing a green chip having parallel or substantially parallel side surfaces located inside and parallel or substantially parallel to the side surfaces of the element body and a laminate structure including a plurality of green ceramic layers to be formed into the ceramic layers and a plurality of pairs of green internal electrodes to be formed into the internal electrodes so that the green internal electrodes are exposed to the parallel or substantially parallel side surfaces; forming ceramic side surface layers on the parallel or substantially parallel side surfaces of the green chip to form the side surfaces of the element body by supplying a green ceramic material on the parallel or substantially parallel side surfaces of the green chip so as to cover the green internal electrodes exposed to the parallel or substantially parallel side surfaces; polishing the green chip provided with the ceramic side surface layers to obtain a green element body to be formed into the element body including the chamfer portions; and firing the green element body; and in the polishing step, intersections lines extending from the interfaces between the green chip and the ceramic side surface layers and external surfaces of the green element body are located within respective curved-surface formation ranges of the chamfer portions. ### Claim 2 (depends on 1) The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the step of preparing a green chip includes the steps of: forming a plurality of lines of belt-shaped internal electrode patterns on ceramic green sheets; forming a mother block by laminating the ceramic green sheets while the ceramic green sheets are shifted by predetermined intervals in a width direction perpendicular or substantially perpendicular to a longitudinal direction in which the belt-shaped internal electrode patterns extend; and cutting the mother block along imaginary cutting lines in the longitudinal direction and imaginary cutting lines in the width direction. ### Claim 3 (depends on 2) The method for manufacturing a multilayer ceramic electronic component according to claim 2, wherein the belt-shaped internal electrode patterns each include a pair of sides linearly extending along the longitudinal direction, and the imaginary cutting lines in the longitudinal direction are located so as to equally divide the respective belt-shaped internal electrode patterns into two portions in the width direction. ### Claim 4 (depends on 3) The method for manufacturing a multilayer ceramic electronic component according to claim 3, wherein the belt-shaped internal electrode patterns each include a plurality of hole portions in which no internal electrode pattern is formed, the hole portions are provided at a center of each belt-shaped internal electrode pattern in the width direction with predetermined pitches along the longitudinal direction, and the imaginary cutting lines in the longitudinal direction are located so as to equally divide the respective hole portions into two portions in the width direction. ### Claim 5 (depends on 2) The method for manufacturing a multilayer ceramic electronic component according to claim 2, wherein the belt-shaped shaped internal electrode patterns each include one pair of zigzag sides extending along the longitudinal direction so as to be engaged with adjacent belt-shaped internal electrodes patterns, zigzag gap regions extending along the longitudinal direction are formed between the adjacent belt-shaped internal electrode patterns, and the imaginary cutting lines in the longitudinal direction are located so as to equally divide the respective gap regions into two portions in the width direction. ### Claim 6 A multilayer ceramic electronic component comprising: an element body including a pair of principal surfaces facing each other, a pair of side surfaces facing each other, and a pair of end surfaces facing each other, rounded chamfer portions arranged along ridgelines between the side surfaces and the end surfaces, and a plurality of ceramic layers extending in a principal surface direction and laminated in a direction perpendicular or substantially perpendicular thereto and a plurality of pairs of internal electrodes which are provided along interfaces between the ceramic layers, which each include an exposure end exposed to one of the pair of end surfaces, and which are not exposed to the side surfaces; and external electrodes provided at least on the pair of end surfaces of the element body so as to be electrically connected to the exposure ends of the internal electrodes; wherein each of the internal electrodes includes: a facing portion including a pair of sides parallel or substantially parallel to the side surfaces and facing an adjacent internal electrode with at least one of the ceramic layers interposed therebetween; and an extending portion extending from the facing portion to the end surface to define the exposure end at the end of the extending portion; wherein a width of the exposure end of the extending portion is smaller than a width of the facing portion when viewed in a width direction between the side surfaces; and when a gap dimension from the side of the facing portion to the side surface of the element body is represented by Wg, a curvature radius of a curved surface of the chamfer portion is represented by Rd, and a distance from the side of the facing portion to the exposure end is represented by D, Wg