# US 2012/0073123 A1 · Method of manufacturing thermal head

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- Number: US 2012/0073123 A1
- Document ID: US20120073123A1
- Status: Published application
- Kind: A1
- Application number: 13/200,251
- Filed: 2011-09-21
- Published: 2012-03-29
- Earliest claimed: 2010-09-24
- Inventors: Noriyoshi Shoji; Norimitsu Sanbongi; Toshimitsu Morooka; Keitaro Koroishi
- Web page: https://patentgrep.com/patent/US20120073123A1

## CPC

- H01C 17/065: by thick film techniques, e.g. serigraphy
- B41J 2/335: Structure of thermal heads
- B41J 2/33585: {Hollow parts under the heater}
- B41J 2/3359: {Manufacturing processes}
- Y10T 29/49082: Resistor making
- H01C: RESISTORS
- B41J: TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A method of manufacturing a thermal head, comprising: forming a concave portion opened in one surface of a support substrate and an upper substrate to be disposed on the support substrate in a stacked state, the support substrate and the upper substrate each being of a plate shape; a step of measuring a width dimension of the concave portion formed in the concave portion forming step; bonding the support substrate and the upper substrate to each other in the stacked state so as to close an opening of the concave portion; thinning the upper substrate bonded onto the support substrate in the bonding, to a thickness set based on the width dimension of the concave portion measured in the measuring; and forming a heating resistor on a surface of the thinned upper substrate in a region opposed to the concave portion.

## Claims

### Claim 1

A method of manufacturing a thermal head, comprising:
forming a groove portion, which is opened in one surface of at least one of a first substrate and a second substrate to be disposed on the first substrate in a stacked state, the first substrate and the second substrate each being of a plate shape;
measuring a width dimension of the groove portion formed in the forming of the groove portion;
bonding the first substrate and the second substrate to each other in the stacked state so as to close an opening of the groove portion formed in the forming of the groove portion;
thinning the second substrate, which is bonded onto the first substrate in the bonding, to a thickness set based on the width dimension of the groove portion measured in the measuring; and
forming a heating resistor on a surface of the second substrate, which is thinned in the thinning, in a region opposed to the groove portion.

### Claim 2

A method of manufacturing a thermal head, comprising:
forming a groove portion, which is opened in one surface of at least one of a first substrate and a second substrate to be disposed on the first substrate in a stacked state, the first substrate and the second substrate each being of a plate shape;
measuring a depth dimension of the groove portion formed in the forming of the groove portion;
bonding the first substrate and the second substrate to each other in the stacked state so as to close an opening of the groove portion formed in the forming of the groove portion;
thinning the second substrate, which is bonded onto the first substrate in the bonding, to a thickness set based on the depth dimension of the groove portion measured in the measuring; and
forming a heating resistor on a surface of the second substrate, which is thinned in the thinning, in a region opposed to the groove portion.

### Claim 3

A method of manufacturing a thermal head, comprising:
forming a groove portion, which is opened in one surface of at least one of a first substrate and a second substrate to be disposed on the first substrate in a stacked state, the first substrate and the second substrate each being of a plate shape;
measuring a width dimension and a depth dimension of the groove portion formed in the forming of the groove portion;
bonding the first substrate and the second substrate to each other in the stacked state so as to close an opening of the groove portion formed in the forming of the groove portion;
thinning the second substrate, which is bonded onto the first substrate in the bonding, to a thickness set based on the width dimension and the depth dimension of the groove portion measured in the measuring; and
forming a heating resistor on a surface of the second substrate, which is thinned in the thinning, in a region opposed to the groove portion.