Thermal-analysis-model generating apparatus, thermal-analysis-model generating program, thermal-analysis-model generating method, and thermal analysis apparatus

A thermal analysis apparatus comprising:

• an area calculating unit that calculates an area of a predetermined range including an electronic component mounted on a printed-circuit board;
• a counting unit that counts the number of via holes included in the predetermined range of which the area is calculated by the area calculating unit;
• a first calculating unit that calculates a first physical property value using the area calculated by the area calculating unit, the number of via holes counted by the counting unit, and a preset physical property value of a conductor;
• a model generating unit that generates a thermal analysis model subject to thermal analysis in which a preset physical property value is set in the electronic component and a heat release path having the first physical property value calculated by the first calculating unit is provided in the printed-circuit board so as to extend from the electronic component in a layer direction of the printed-circuit board;
• and
• an executing unit that executes the thermal analysis on the thermal analysis model generated by the model generating unit.

A thermal-analysis-model generating method executed by a computer, the method comprising:

• calculating an area of a predetermined range including an electronic component mounted on a printed-circuit board;
• counting the number of via holes included in the predetermined range of which the area is calculated;
• calculating a first physical property value using the calculated area, the number of via holes counted, and a preset physical property value of a conductor;
• and
• generating a thermal analysis model subject to thermal analysis in which a preset physical property value is set in the electronic component and a heat release path having the calculated first physical property value is provided in the printed-circuit board so as to extend from the electronic component in a layer direction of the printed-circuit board.

A non-transitory computer-readable storage medium storing a program for generating a thermal-analysis-model, the program causing a computer to execute:

• calculating an area of a predetermined range including an electronic component mounted on a printed-circuit board;
• counting the number of via holes included in the predetermined range of which the area is calculated;
• calculating a first physical property value using the calculated area, the number of via holes counted, and a preset physical property value of a conductor;
• and
• generating a thermal analysis model subject to thermal analysis in which a preset physical property value is set in the electronic component and a heat release path having the calculated first physical property value is provided in the printed-circuit board so as to extend from the electronic component in a layer direction of the printed-circuit board.