Method and apparatus for preparing fold lines
AssigneeSIG Technology AG
InventorsWerner Seiche, Toma Schneider, Jörg Berger
Life of this patent
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Abstract
The method and the apparatus are used for preparing fold lines on laminated materials on the basis of cardboard. At least one region intended for providing the fold line is subjected to heat such that an at least partial local reduction of shear fracture stresses of the material is produced in said region. The application of heat is done using a heating device, which is disposed adjacent to a guide device for the laminate. The local reduction of the shear fracture stresses supports local delamination, which supports the formation of a folding joint.
Claims21
1-20. (canceled)
A method for preparing fold lines in laminated materials based on cardboard for producing containers, the method comprising the step of thermally treating at least one area intended for preparation of a fold line so that shear fracture stresses of the material are at least partially decreased locally in this area, as a result of which local delamination in this area is supported.
An apparatus for preparing fold lines in laminated materials based on cardboard for production of containers, the apparatus comprising:
- a guide device for the laminate to be provided with a fold line;
- and a heating device arranged adjacent to the guide device, the heating device having a heating output sufficient to achieve a predetermined local decrease in shear fracture stresses of the laminate at least in certain areas around the fold line.
Dependencies are inferred from the claim text.