Methods and apparatuses facilitating fluid flow into via holes, vents, and other openings communicating with surfaces of substrates of semiconductor device components
AssigneeMicron Technology, Inc.
InventorRoss S. Dando
Life of this patent
Estimating the term…
Abstract
A method for removing material from surfaces of at least a portion of at least one recess or at least one aperture extending into a surface of a substrate includes pressurizing fluid so as to cause the fluid to flow into the at least one recess or at least one aperture. The fluid may be pressurized by generating a pressure differential across the substrate, which causes the fluid to flow into or through the at least one aperture or recess. Apparatus for pressurizing fluid so as to cause it to flow into or through recesses or apertures in a substrate are also disclosed.
Claims27
A method for removing material from surfaces of at least one recess or at least one aperture extending into a surface of a substrate, comprising pressurizing fluid so as to cause the fluid to flow into the at least one recess or at least one aperture.
An apparatus for generating a pressure differential across a substrate, comprising:
- a chamber;
- at least one substrate holder located substantially along at least one boundary within the chamber and configured to hold a substrate such that fluid communication between a first region of the chamber and a second region of the chamber is limited to at least one aperture extending substantially through the substrate;
- and
- at least one pressurization component associated with at least one of the first region of the chamber and the second region of the chamber.
A differential pressure apparatus, comprising:
- a chamber;
- at least one substrate holder located substantially along at least one boundary within the chamber and comprising:
- at least one recess configured to support a peripheral portion of a substrate;
- at least one opening configured to expose a substantial portion of the substrate proximate the peripheral portion of the substrate;
- and
- at least one sealing element configured to limit fluid communication between a first region of the chamber and a second region of the chamber to at least one aperture extending substantially through the substrate;
- and
- at least one pressurization component.
A method for removing obstructions or irregularities from surfaces of at least one aperture that extends substantially through a substrate, comprising forcing an etchant into an opening of the at least one aperture at a first surface of the substrate, through the at least one aperture, and out an opening of the at least one aperture at a second surface of the substrate.
Dependencies are inferred from the claim text.