Semiconductor device and method for manufacturing the same
AssigneeFujitsu Semiconductor Limited
InventorTakuji Tanaka
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AssigneeFujitsu Semiconductor Limited
InventorTakuji Tanaka
Estimating the term…
A method for manufacturing a semiconductor device includes steps of preparing a semiconductor substrate having a first conductive type; implanting a first impurity having the first conductive type in the semiconductor substrate to form a well region having a bottom portion; and implanting a second impurity having a second conductive type in the semiconductor substrate to form an impurity region having a top portion, the top of the impurity region being in contact with the bottom portion of the well region. Implantation of the second impurity includes a first step of implanting the second impurity and a second step of implanting the second impurity, wherein a first implantation area of the first step of implanting the second impurity being broader or narrower than a second implantation area of the second step of implanting the second impurity.
A method for manufacturing a semiconductor device, comprising:
Dependencies are inferred from the claim text.