Dicing die bond film, method of manufacturing dicing die bond film, and method of manufacturing semiconductor device

A method of manufacturing a dicing die bond film comprising a dicing film including a base and a pressure-sensitive adhesive layer provided thereon, and a die bond film provided on the pressure-sensitive adhesive layer, comprising the steps of:

• forming on the base a pressure-sensitive adhesive layer precursor that is constituted with a polymer formed by performing an addition reaction on an acrylic polymer containing 10 to 40 mol % of a hydroxyl group-containing monomer with an isocyanate compound having 70 to 90 mol % of a radical reactive carbon-carbon double bond with respect to the hydroxyl group-containing monomer, and a crosslinking agent having two or more functional groups exhibiting reactivity to a hydroxyl group in a molecule and having a content of 0.5 to 2 parts by weight to 100 parts by weight of the polymer,
• forming a pressure-sensitive adhesive layer in which the 180 degree peeling adhesive power to a silicon mirror wafer of a portion of the pressure-sensitive adhesive layer where a dicing ring is pasted is 1.0 N/20 mm tape width or more and 10.0 N/20 mm tape width or less under conditions of a measurement temperature of 23±3° C. and a tensile speed of 300 mm and in which the tensile storage modulus at 23° C. of a portion where the dicing ring is pasted is 0.05 MPa or more and less than 0.4 MPa by irradiating the pressure-sensitive adhesive layer precursor with an ultraviolet ray under a prescribed condition, and
• pasting the die bond film onto the pressure-sensitive adhesive layer.