Module with silicon-based layer
AssigneeInfineon Technologies AG
InventorsRalf Otremba, Xaver Schloegel, Christof Matthias Schilz
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Abstract
The invention concerns a module comprising a carrier element, a semiconductor device mounted on said carrier element and a silicon-based insulating layer. The silicon-based insulating layer is arranged on the side of the carrier element opposite to the semiconductor device. The invention further concerns a module comprising a semiconductor device, a mold compound at least partly covering the semiconductor device and a silicon-based passivation layer. The silicon-based passivation layer covers at least partly the periphery of the mold compound.
Claims17
A method comprising the steps:
- providing a carrier element;
- mounting a semiconductor device on said carrier element;
- and depositing a silicon-based insulating layer on a side of the carrier element opposite to the side on which the semiconductor device is or is to be mounted.
A method, comprising the steps:
- providing a semiconductor device;
- depositing a mold compound on said semiconductor device;
- and depositing a silicon-based passivation layer on a periphery of said mold compound.
Dependencies are inferred from the claim text.