Laser patterning apparatus and laser patterning method
AssigneeFuji Electric Co., Ltd.
InventorsMasaaki TODA, Satoshi SAWAYANAGI
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AssigneeFuji Electric Co., Ltd.
InventorsMasaaki TODA, Satoshi SAWAYANAGI
Estimating the term…
Aspects of the invention are directed to laser patterning apparatus capable of performing laser patterning on a thin film formed on a flexible substrate with a good yield and a laser patterning method thereof. The thin film formed on the flexible substrate can be patterned by laser using a laser patterning apparatus that can include a processing stage that has a reference processing surface on which the flexible substrate having the thin film formed thereon is disposed, a wrinkle removing device that is configured as a mechanism for stretching an outer periphery of a processing region of the flexible substrate so that tension is applied outward in the width direction and forward and backward in the transporting direction, and a laser scanner that scans a predetermined line of the thin film formed on the flexible substrate while emitting a laser beam thereto.
A laser patterning apparatus comprising:
A laser patterning method comprising:
Dependencies are inferred from the claim text.