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US 2012/0070931 A1Published application
Methods for reduced stress anchors
AssigneeHoneywell International Inc.
InventorsMichael Foster, Mark Williams, Mark Eskridge
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Abstract
Methods of anchoring components of a Micro-Electro-Mechanical Systems (MEMS) device to a substrate. An exemplary embodiment has a trace anchor bonded to a substrate, a device anchor bonded to the substrate, and an anchor flexure configured to flexibly couple the trace anchor and the device anchor to substantially prevent transmission of a stress induced in the trace anchor from being transmitted to the device anchor.
Claims5
A method of anchoring a Micro-Electro-Mechanical Systems (MEMS) device to a substrate, the method comprising:
- bonding a trace anchor of the MEMS device to a trace anchor mesa of the substrate, wherein at least a trace induces a stress into the trace anchor;
- bonding a device anchor of the MEMS device to a device anchor mesa of the substrate;
- and
- flexibly coupling the device anchor to the trace anchor by an anchor flexure that substantially prevents transmission of the stress induced in the trace anchor to the device anchor.
1 more element
Dependencies are inferred from the claim text.