US 2012/0070780 A1Published application

Photosensitive resin composition, dry film solder resist, and circuit board

AssigneeLG Chem, Ltd.

InventorsBo-Yun CHOI, Byung-Ju CHOI, Woo-Jae JEONG, Kwang-Joo LEE, Min-Su JEONG

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Abstract

The present invention relates to a photosensitive resin composition including an acid modified oligomer, a photopolymerizable monomer, a thermosetting binder resin, a photoinitiator, and a thioxanthone compound, a dry film solder resist obtained from the resin composition, and a circuit board including the dry film solder resist.

Claims18

Dependent claims

A photosensitive resin composition comprising an acid modified oligomer, a photopolymerizable monomer, a thermosetting binder resin, a photoinitiator, and a thioxanthone compound.

Dependencies are inferred from the claim text.

Facts

Application: 13/235,071Filed 16 Sep 2011
Priority: KR 10-2010-009108416 Sep 2010
Published: 22 Mar 2012
Term ends: Not estimatedThe source records don’t support an estimate.

Classification5 codes

G03F 7/032
Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds: with binders
G03F 7/029
With photosensitivity-increasing substances, e.g. photoinitiators: inorganic compounds; Onium compounds; Organic compounds having hetero atoms…
G03F 7/033
With binders: the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
G03F 7/035
With binders: the binders being polyurethanes

Family

No related US applications are recorded in the indexed filing history.

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