Radio frequency transparent vapor barrier
AssigneeRaytheon Company
InventorThomas W. Graf
Life of this patent
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Abstract
In some examples, the technology described herein includes a radio frequency transparent vapor barrier assembly. The barrier assembly includes a substrate having a three-dimensional surface. The barrier assembly further includes at least one barrier stack positioned adjacent to the three-dimensional surface of the substrate. The at least one barrier stack includes at least one first inorganic layer and at least one second inorganic layer. The least one barrier stack substantially prevents vapor penetration to the substrate.
Claims12
A radio frequency transparent vapor barrier assembly comprising:
- a substrate having a three-dimensional surface;
- and
- at least one barrier stack positioned adjacent to the three-dimensional surface of the substrate and comprising at least one first inorganic layer and at least one second inorganic layer;
- wherein the least one barrier stack substantially prevents vapor penetration to the substrate.
A process for making a radio frequency transparent vapor barrier assembly comprising:
- providing a substrate having a three-dimensional surface;
- and
- assembling at least one barrier stack atop the three-dimensional surface of the substrate by:
- forming a first inorganic layer, and
- forming a second inorganic layer;
- wherein the least one barrier stack substantially prevents vapor penetration to the substrate.
Dependencies are inferred from the claim text.