US 2012/0070670 A1Published application

Hybrid components with reactive hotmelt adhesives

AssigneeEvonik Degussa GmbH

InventorsAndreas Pawlik, Martin Risthaus, Jochen Fritz

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Abstract

A description is given of the use of reactive hotmelt adhesives based on copolyamide and further comprising isocyanate and epoxide and also a functionalized polyolefin in hybrid components. These hybrid components find applications in vehicle construction and in aircraft construction, for example.

Claims19

Dependent claims

A process for producing a hybrid component, the process comprising joining a metal component to a polymer component with a copolyamide-based hotmelt adhesive comprising a copolyamide, an isocyanate, an epoxide, and a functionalized polyolefin.

Dependencies are inferred from the claim text.

Facts

Application: 13/322,673Filed 31 Mar 2010
Priority: DE 10 2009 026 493.027 May 2009
Published: 22 Mar 2012
Term ends: Not estimatedThe source records don’t support an estimate.

Classification36 codes

B32B 7/12
Interconnection of layers: using interposed adhesives or interposed materials with bonding properties
B32B 7/14
Using interposed adhesives or interposed materials with bonding properties: applied in spaced arrangements, e.g. in stripes
B32B 15/08
Comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material: of synthetic resin
B32B 27/08
As the main or only constituent of a layer, which is next to another layer of the same or of a different material: of synthetic resin

Family

US 9,205,630 B2Related patent
US 2012/0070670 A1This patent

From the US filing history. Foreign family members aren’t listed.

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