Production method of workpiece and workpiece with three-dimensional pattern
AssigneeCompal Electronics, Inc.
InventorsWan-Li Chuang, Chien-Min Chang, Ju-Chen Chiu, Chih-Hua Liu, Tsung-Sheng Chuang
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AssigneeCompal Electronics, Inc.
InventorsWan-Li Chuang, Chien-Min Chang, Ju-Chen Chiu, Chih-Hua Liu, Tsung-Sheng Chuang
Estimating the term…
A production method of workpiece is provided. First, an adhesive layer is applied on a workpiece, wherein a material of the adhesive layer includes thermosetting resin and radiationcurable resin. The adhesive layer is impressed by a mold, so that the adhesive layer forms a three-dimensional pattern. A first curing process is performed on the adhesive layer by one of radiation-curing and thermal-curing. The workpiece is punched after the first curing process is performed on the adhesive layer, so that the workpiece forms a three-dimensional workpiece. A second curing process is performed on the adhesive layer by another one of radiation-curing and thermal-curing after the workpiece is punched. In addition, a workpiece with three-dimensional pattern is also provided.
A production method of a workpiece, the production method comprising:
A workpiece with three-dimensional pattern, comprising:
Dependencies are inferred from the claim text.