Conductive film forming method, conductive film forming apparatus and conductive film
AssigneeTokyo Electron Limited
InventorTohru Nukui
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Abstract
There is provided a conductive film forming method including disposing a material 2 containing a fiber-shaped conductive substance 2a and having fluidity between a substrate 3 and a mold 1 having thereon prominences and depressions 1a; reducing the fluidity of the material 2; and separating the mold 1 from the material 2.
Claims15
A conductive film forming method comprising:
- disposing a material containing a fiber-shaped conductive substance and having fluidity between a substrate and a mold having thereon prominences and depressions;
- reducing the fluidity of the material;
- and
- separating the mold from the material.
A conductive film forming method comprising:
- coating a material containing a fiber-shaped conductive substance and having fluidity on a mold having thereon prominences and depressions;
- bringing a substrate into contact with the material coated on the mold to dispose the material between the substrate and the mold;
- reducing the fluidity of the material;
- and
- separating the mold from the material.
A conductive film forming method comprising:
- coating a material containing a fiber-shaped conductive substance and having fluidity on a substrate;
- providing the material between the substrate and a mold having thereon prominences and depressions by bringing the mold into contact with the material coated on the substrate;
- reducing the fluidity of the material;
- and
- separating the mold from the material.
A conductive film forming method comprising:
- placing a mold having thereon prominences and depressions to be adjacent to a substrate while allowing the prominences and depressions to face the substrate;
- providing a material containing a fiber-shaped conductive substance and having fluidity between the substrate and the mold by supplying the material into a space between the mold and substrate;
- reducing the fluidity of the material;
- and
- separating the mold from the material.
A conductive film forming apparatus for forming a conductive film on a substrate, the apparatus comprising:
- a vessel that stores therein a material containing a fiber-shaped conductive substance and having fluidity, and that includes a device for mixing the material;
- a mold having thereon prominences and depressions;
- a nozzle, communicating with the vessel, for coating the material on either the mold or the substrate;
- a device for placing the substrate to be adjacent to the mold;
- and
- a hardening unit for reducing the fluidity of the material between the mold and the substrate.
A conductive film comprising:
- a fiber-shaped conductive substance;
- and
- a layer having prominences and depressions on a top surface thereof.
Dependencies are inferred from the claim text.