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US 2012/0070570 A1Published application
Conductive thick metal electrode forming method
AssigneeXerox Corporation
InventorsWoo Soo KIM, Ping LIU, Yiliang WU, Nan-Xing HU
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Abstract
A method of forming conductive features on a substrate, the method includes, filling a flexible stamp with a metal nanoparticle composition, depositing the metal nanoparticle composition onto the substrate, and heating the deposited metal nanoparticle composition during or after the depositing to form the conductive features.
Claims20
A method of forming conductive features on a substrate, the method comprising:
- filling a flexible stamp with a metal nanoparticle composition,
- depositing the metal nanoparticle composition onto the substrate, and
- heating the metal nanoparticle composition during or after the depositing to form the conductive features.
A method of forming conductive features on a substrate, the method comprising:
- filling a flexible stamp with a metal nanoparticle composition comprised of organic-stabilized metal nanoparticles and a solvent,
- depositing the metal nanoparticle composition onto the substrate, and
- heating the deposited metal nanoparticle composition during or after the depositing to a temperature of from about 80° C. to about 200° C. to form the conductive features.
Dependencies are inferred from the claim text.