Resistance change element and resistance change memory
AssigneeKabushiki Kaisha Toshiba
InventorJunichi WADA
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Abstract
According to one embodiment, a resistance change element includes a first film provided on a first electrode side, a second film provided on a second electrode side, a barrier film sandwiched between the first film and the second film, and metal impurities added in the first or second film, the metal impurities migrating between the first and second films bi-directionally according to a direction of a first electric field generated between the first and second electrodes. The resistance change element has a first resistance state when the metal impurities are present in the first film, and the resistance change element has a second resistance state different from the first resistance state when the metal impurities are present in the second film.
Claims20
A resistance change element comprising:
- a first film provided on a first electrode side;
- a second film provided on a second electrode side;
- a barrier film sandwiched between the first film and the second film;
- and
- metal impurities added in the first or second film, the metal impurities migrating between the first and second films bi-directionally according to a direction of a first electric field generated between the first and second electrodes,
- wherein a first resistance state is exhibited when the metal impurities are present in the first film, and
- a second resistance state different from the first resistance state is exhibited when the metal impurities are present in the second film.
A resistance change memory comprising:
- a first interconnect line extending in a first direction;
- a second interconnect line extending in a second direction that intersects the first direction;
- and
- a cell unit provided between the first interconnect line and the second inter connect line, the cell unit including a memory element in which data to be stored and a variable resistance value are associated,
- the memory element including first and second electrodes, first and second films between the first and second electrodes, a barrier film between the first film and the second film and metal impurities added in the first or second film,
- wherein the metal impurities migrate between the first and second films bi-directionally according to the direction of a first electric field generated between the first and second electrodes,
- when the metal impurities are present in the first film, the memory element exhibits a first resistance state, and
- when the metal impurities are present in the second film, the memory element exhibits a second resistance state different from the first resistance state.
Dependencies are inferred from the claim text.