Printed circuit board, printed circuit board assembly sheet and method of manufacturing the same
AssigneeNitto Denko Corporation
InventorsTerukazu IHARA, Naohiro TERADA
Life of this patent
Estimating the term…
Abstract
A determination mark formation portion is provided in each suspension board. In the determination mark formation portion, a recess having a given depth is provided in a base insulating layer. An outer peripheral portion is formed on the base insulating layer to surround the recess. A plating layer is formed on the outer peripheral portion. A circular hole is formed on a support substrate. The hole of the support substrate and the recess of the base insulating layer overlap each other.
Claims9
A printed circuit board comprising:
- a support substrate having an opening;
- a base insulating layer formed on said support substrate to cover said opening;
- and
- a conductor pattern formed on said base insulating layer.
A method of manufacturing a printed circuit board assembly sheet in which a plurality of printed circuit boards are integrally provided, comprising the steps of:
- forming base insulating layers of said plurality of printed circuit boards on a support substrate;
- forming conductor patterns on said base insulating layers of said plurality of printed circuit boards, respectively;
- forming openings in respective regions of said support substrate corresponding to said plurality of printed circuit boards;
- determining whether or not each of said plurality of printed circuit boards is acceptable;
- and
- applying ink to a region of said base insulating layer overlapping said opening of the printed circuit board determined as an acceptable item or the printed circuit board determined as a defective item.
Dependencies are inferred from the claim text.