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US 2012/0069537 A1Published application
Integrated circuit with intra-chip clock interface and methods for use therewith
AssigneeBroadcom Corporation
InventorAhmadreza (Reza) Rofougaran
Life of this patent
Estimating the term…
Abstract
An integrated circuit includes a substrate. A first integrated circuit die includes a first circuit and a first intra-chip clock interface that transmits a first clock signal via the substrate. A second integrated circuit die includes a second circuit that operates based on the first clock signal and a second intra-chip clock interface that recovers the first clock signal from the substrate.
Claims13
An integrated circuit comprising:
- a substrate;
- a first integrated circuit die coupled to the substrate, the first integrated circuit die including a first intra-chip clock interface coupled to the substrate that transmits a first clock signal;
- a second integrated circuit die coupled to the substrate, the second integrated circuit die including:
- a circuit that operates based on the first clock signal;
- a second intra-chip clock interface coupled to the substrate that recovers the first clock signal;
- wherein the substrate includes wave guide for coupling the first clock signal from the first intra-chip clock interface to the second intra-chip clock interface as a radio frequency signal.
3 more elements
An integrated circuit comprising:
- a substrate;
- a first integrated circuit die coupled to the substrate, the first integrated circuit die including a first intra-chip clock interface coupled to the substrate that transmits a first clock signal;
- a second integrated circuit die coupled to the substrate, the second integrated circuit die including:
- a circuit that operates based on the first clock signal;
- a second intra-chip clock interface coupled to the substrate that recovers the first clock signal;
- wherein the substrate includes a magnetic path for inductively coupling the first clock signal from the first intra-chip clock interface to the second intra-chip clock interface.
3 more elements
A method comprising:
- communicating a first clock signal having a millimeter wave frequency from a first integrated circuit die to a second integrated circuit via a substrate that supports the first integrated circuit die and the second integrated circuit die.
Dependencies are inferred from the claim text.