Conducting paste for device level interconnects

A method of forming an electrically conducting paste mixture with metal loading in the range of 85-95% useful for connecting micron device level interconnects, the method comprising:

• a) embedding a nano particle within a polymer constituent by adding a resin to a silver nano particle solution in low temperature boiling solvent;
• b) dissolving said polymer constituent containing said nano particles in said silver nano particle solution by evaporating said low temperature boiling solvent to form an embedded nano particle polymer;
• c) combining said embedded nano particle polymer constituent with dry micro powder and an anhydride;
• and
• d) fully mixing said embedded nano particle polymer, anhydride, and micropowder.

A method of forming an electrically conducting paste mixture that is effective for low temperature sintering and can precipitate a minimum amount of nano particles uniformly, the method comprising:

• a) mixing micro particles with nano particles in a solvent;
• b) drying said solvent under a vacuum to evaporate said solvent;
• and
• c) synthesizing said remaining nano particles in the presence of said micro particles.

A method of sensor fabrication of a device, such as an infrared camera, using an electronically conductive paste, the method comprising:

• a) providing a sensor no greater than 5 microns that contains a plurality of micro pillar connects;
• b) placing electrically conductive paste on said plurality of micro pillar connects;
• c) connecting said micro pillar connects to a processor;
• and
• d) creating an excellent connection between said sensor and said processor that has good electrical yield and low contact resistance.

An electrical package comprising:

• a) a plurality of planar micro arrays in stack form substantially parallel to each other;
• b) electrically conductive traces disposed on the surfaces of said micro arrays;
• and
• c) a plurality of micro pillars connected to said electrical connection traces, distal ends of said pillars being plated and connected to said traces by means of electrically conductive material.