Power conversion module
AssigneeCyntec Co., Ltd.
InventorsDa-Jung Chen, Kaipeng Chiang, Yu-Chao Fang, Yi-Cheng Lin
Life of this patent
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Abstract
A power conversion module includes a circuit carrier board, a semiconductor module and an inductor module. The circuit carrier board has plural bonding pads. The semiconductor module is disposed on a first surface of the circuit carrier board. The inductor module has plural pins. The pins are extended from the inductor module along a first direction and connected with corresponding bonding pads on the circuit carrier board, so that a receptacle is defined between the inductor module and the circuit carrier board for accommodating the semiconductor module.
Claims17
A power conversion module, comprising:
- a circuit carrier board having plural bonding pads;
- a semiconductor module disposed on a first surface of the circuit carrier board;
- and
- an inductor module having plural pins, wherein the pins are extended from the inductor module along a first direction and connected with corresponding bonding pads on the circuit carrier board, so that a receptacle is defined between the inductor module and the circuit carrier board for accommodating the semiconductor module.
A power conversion module, comprising:
- a circuit carrier board having plural perforations, wherein a first surface and a second surface of the circuit carrier board are in communication with each other through the perforations;
- a semiconductor module disposed on the first surface of the circuit carrier board;
- and
- an inductor module having plural pins, wherein the pins are extended from the inductor module along a first direction, penetrated through corresponding perforations and fixed on the circuit carrier board, so that a receptacle is defined between the inductor module and the circuit carrier board for accommodating the semiconductor module.
A power conversion module, comprising:
- a circuit carrier board having a first surface and a second surface;
- a semiconductor module disposed on a first surface of the circuit carrier board;
- and
- an inductor module having plural L-shaped pins with respective horizontal parts and respective vertical parts, wherein the vertical parts of the L-shaped pins are extended from the inductor module along a first direction, and the horizontal parts of the L-shaped pins are soldered on the second surface of the circuit carrier board, so that a receptacle is defined between the inductor module and the circuit carrier board for accommodating the semiconductor module.
A power conversion module, comprising:
- a circuit carrier board having plural pins extended along a first direction;
- a semiconductor module disposed on a first surface of the circuit carrier board;
- and
- an inductor module having plural bonding pads, wherein the bonding pads and corresponding pins of the circuit carrier board are electrically connected with each other, so that a receptacle is defined between the inductor module and the circuit carrier board for accommodating the semiconductor module.
Dependencies are inferred from the claim text.