Thermal module and electronic device incorporating the same
AssigneeFoxconn Technology Co., Ltd.
InventorJUI-WEN HUNG
Life of this patent
Estimating the term…
Abstract
An electronic device includes a circuit board and a thermal module mounted thereon. The circuit board has a heat-generating chip and an electromagnetic interference (EMI) source mounted thereon. The thermal module includes a shielding cover and a heat conducting member. The shielding cover is heat-conductive and electrically-conductive material, and defines a cavity therein. The shielding cover encloses the EMI source in the cavity for EMI shielding. The heat conducting member has one end thermally connecting with the shielding cover and another end thermally connecting with the heat-generating chip for transferring heat from the heat-generating chip to the shielding cover.
Claims16
A thermal module comprising:
- a shielding cover made of heat-conductive and electrically-conductive material, the shielding cover defining a cavity therein for receiving an electromagnetic interference (EMI) source, the shielding cover being configured for enclosing the EMI source for EMI shielding;
- and
- a heat conducting member having one end thermally connecting with the shielding cover and another end configuring for thermally connecting with a heat-generating chip.
An electronic device comprising:
- a circuit board having a heat-generating chip and an electromagnetic interference (EMI) source mounted thereon;
- and
- a thermal module mounted on the circuit board, the thermal module comprising:
- a shielding cover made of heat-conductive and electrically-conductive material, the shielding cover defining a cavity therein, the shielding cover enclosing the EMI source in the cavity for EMI shielding;
- and
- a heat conducting member having one end thermally connecting with the shielding cover and another end thermally connecting with the heat-generating chip for transferring heat from the heat-generating chip to the shielding cover.
A thermal module comprising:
- a shielding cover made of heat-conductive and electrically-conductive material, the shielding cover defining a cavity therein for receiving an electronic component, the shielding cover configured for enclosing the electronic component for electromagnetic interference (EMI) shielding;
- and
- a heat-conductive member having one end thermally connecting with the shielding cover and another end configuring for thermally connecting with a heat-generating electronic component.
Dependencies are inferred from the claim text.