A micro-electromechanical device, said device comprising:
- a substrate;
- a 1st layer level metal plate supported on said substrate;
- a 5th layer level metal plate, supported by two or more metal support pillars laid out around said 5th layer level metal plate on said substrate;
- a 3rd layer level metal plate, and said 3rd layer level metal plate is attached to two or more bendable metal elements mounted on metal support pillars laid out around said 3rd layer level metal plate;
- two or more 2nd layer level metal stopping plates laid out around said 3rd layer level metal plate with making the free ends of said 2nd layer level metal stopping plates overlap slightly to the bottom surface of the edge of said 3rd layer level metal plate below said 3rd layer level metal plate and above said 1st layer level metal plate, while two or more opposite ends to free ends of said 2nd layer level metal stopping plates are connected to each metal support pillar;
- two or more 4th layer level metal stopping plates laid out around said 3rd layer level metal plate with making the free ends of said 4th layer level metal stopping plates overlap slightly to the upper surface of the edge of said 3rd layer level metal plate above said 3rd layer level metal plate and below said 5th layer level metal plate, while two or more opposite ends to free ends of said 4th layer level metal stopping plates are connected to each metal support pillar;
- a 6th layer level metal plate supported by the metal support pillar built on said 3rd layer level metal plate not to make any contact with said 5th layer level metal plate;
- a gap among said 1st layer level metal plate, said 5th layer level metal plate, two or more said 2nd layer level metal stopping plates, two or more said 4th layer metal level stopping plates, two or more said bendable metal elements at 3rd layer level, said 3rd layer level metal plate, said 6th layer level metal plate, and said metal support pillar built on said 3rd layer level metal plate, allowing operable for bending of two or more said bendable metal elements at 3rd layer level, position-movement of said 3rd layer level metal plate together with said metal support pillar built on said 3rd layer level metal plate and said 6th layer level metal plate, and stopping of position-movement of said 3rd layer level metal plate by either said 2nd layer level metal stopping plates or said 4th layer level metal stopping plates;
- and
- a position-movable rigid metal member comprising said 3rd layer level metal plate, said 6th layer level metal plate, said metal support pillar built on said 3rd layer level metal plate, and two or more said bendable metal elements fixed to each metal support pillar on said substrate;
- and
- an electrical connection of a bias voltage to said position-movable rigid metal member and two or more said 2nd layer metal stopping plates and two or more said 4th layer metal stopping plates, the electrical connection of a complementary output voltage to said 1st layer metal plate, and the electrical connection of a complementary output-bar voltage to said 5th layer metal plate, wherein the voltage differential among said 1st layer plate, said 5th layer plate, and said position-movable rigid member is operable to create electrostatic attraction with said 1st layer level metal plate and said 5th layer level metal plate to cause said 3rd layer level metal plate in said position-movable rigid member to move toward either said 1st layer level metal plate or said 5th layer level metal plate and to stop and settle on either two or more said 2nd layer level metal stopping plates or two or more said 4th layer level metal stopping plates, allowing said position-movable rigid member to take at least two states in positioning.