Projection exposure method and projection exposure system therefor

A projection exposure method for exposing a radiation-sensitive substrate, arranged in the region of an image surface of a projection objective, with at least one image of a pattern of a mask arranged in the region of an object surface of the projection objective, the projection exposure method comprising:

• arranging a mask in the region of the object surface of the projection objective, the mask having a first pattern area with a first subpattern, and at least one second pattern area, arranged laterally offset from the first pattern area;
• with a second subpattern;
• illuminating the mask with the aid of illumination radiation from an illumination field of an illumination system in order to produce a projection radiation varied by the mask;
• a defined, local illumination intensity distribution of the illumination radiation being set in a pupil-shaping surface of the illumination system;
• scanning the mask in such a way that initially the first subpattern and thereafter the second subpattern is irradiated with the illumination radiation of the illumination field;
• illuminating the first subpattern during a first illumination time interval, a first angular distribution, adapted to the first subpattern, of the illumination radiation striking the first subpattern being set during the first illumination time interval;
• and
• subsequently illuminating the second subpattern during a second illumination time interval, a second angular distribution, adapted to the second subpattern, of the illumination radiation striking the second subpattern being set during the second illumination time interval, the second angular distribution differing from the first angular distribution.