Chip to dielectric waveguide interface for sub-millimeter wave communications link
AssigneeTexas Instruments Incorporated
InventorsBaher S. Haroun, Marco Corsi, Siraj Akhtar, Nirmal C. Warke
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Abstract
In some developing interconnect technologies, such as chip-to-chip optical interconnect or metal waveguide interconnects, misalignment can be a serious issue. Here, however, a interconnect that uses an on-chip directional antenna (which operates in the sub-millimeter range) to form a radio frequency (RF) interconnect through a dielectric waveguide is provided. This system allows for misalignment while providing the increased communication bandwidth.
Claims18
An apparatus comprising:
- a housing having a receptacle formed therein, wherein the receptacle is adapted to receive at least a portion of a dielectric waveguide;
- and
- an integrated circuit (IC) secured within the housing, wherein the IC includes:
- a directional antenna that is adapted to provide a communication link with the dielectric waveguide;
- and
- a steering circuit that is coupled to directional antenna, wherein the steering circuit is adapted to adjust the directional antenna to couple the IC with the dielectric waveguide if the receptacle and directional antenna are misaligned.
An apparatus comprising:
- a plastic housing having a receptacle therein, wherein the receptacle is adapted to receive at least a portion of a dielectric waveguide;
- an IC encapsulated within the plastic housing, wherein the IC includes:
- a directional antenna that is adapted to provide a communication link with the dielectric waveguide;
- and
- a steering circuit that is coupled to directional antenna, wherein the steering circuit is adapted to adjust the directional antenna to couple the IC with the dielectric waveguide if the receptacle and directional antenna are misaligned;
- a leadframe that is at least partially encapsulated within the plastic housing;
- and
- a plurality of wire bonds to secured to the IC and to the leadframe, wherein each bond wire is encapsulated within the plastic housing.
The apparatus of claim 11, wherein the radiator further comprises a patch antenna.
An apparatus comprising:
- a plastic housing having a receptacle therein, wherein the receptacle is adapted to receive at least a portion of a dielectric waveguide;
- an IC encapsulated within the plastic housing, wherein the IC includes:
- communication circuitry;
- a directional antenna that is coupled to the communication circuitry and that is adapted to provide a communication link with the dielectric waveguide;
- and
- a steering circuit that is coupled to directional antenna, wherein the steering circuit is adapted to adjust the directional antenna to couple the IC with the dielectric waveguide if the receptacle and directional antenna are misaligned;
- a leadframe that is at least partially encapsulated within the plastic housing;
- and
- a plurality of wire bonds to secured to the IC and to the leadframe, wherein each bond wire is encapsulated within the plastic housing.
Dependencies are inferred from the claim text.