Antenna, component and methods

A chip component, comprising:

• a dielectric substrate comprising a plurality of surfaces;
• a first antenna element disposed at least partially on a first of said plurality of surfaces and at least partially on a second of said plurality of surfaces, the first antenna element adapted to be electrically coupled to a feed structure at a first location;
• a second antenna element disposed at least partially on a third of said plurality of surfaces, the third of said plurality of surfaces substantially opposing the first of said plurality of surfaces, and at least partially on the second of said plurality of surfaces, the second antenna element adapted to be coupled to a ground plane at least at a second location;
• and
• an electromagnetic coupling element disposed substantially between the first antenna element and the second antenna element and configured to electromagnetically couple the second antenna element to the feed structure.

An antenna comprising:

• a dielectric substrate comprising a plurality of surfaces;
• a first antenna element disposed at least partially on a first surface of said substrate and at least partially on a second surface of said substrate, the first antenna element adapted to be coupled to a feed structure at a first location and to a ground plane at a second location;
• a second antenna element disposed at least partially on both a third surface and the second surface of said substrate, the third surface substantially opposing said first surface, the second antenna element configured to permit coupling to the ground plane at least at a third location;
• and
• an electromagnetic coupling element disposed substantially between the first antenna element and the second antenna element, and configured to electromagnetically couple the second antenna element to the feed structure.

A radio frequency device adapted for wireless communications, the radio frequency device comprising:

• a printed circuit board comprising a ground plane, a feed structure, and an antenna apparatus for enabling at least a portion of the wireless communications, the antenna apparatus comprising:
• a dielectric substrate comprising a plurality of surfaces;
• a first antenna element disposed at least partially on a first surface of said substrate and at least partially on a second surface of said substrate, the first antenna element galvanically coupled to a feed structure at a first location;
• a second antenna element disposed at least partially on a third surface of said substrate, the third surface substantially parallel yet opposite the first surface, and at least partially on the second surface, the second antenna element coupled to the ground plane at least at a second location;
• and
• an electromagnetic coupling element disposed at least partly between the first antenna element and the second antenna element and configured to electromagnetically couple the second antenna element to the feed structure.

A chip component, comprising:

• a dielectric substrate comprising a plurality of surfaces;
• a conductive layer disposed at least partly on a first surface of the substrate, the conductive layer having a first portion and a second portion, the first portion adapted for electrical coupling to a feed structure at a first location, and the second portion adapted to couple to a ground plane at a second location;
• and
• an electromagnetic coupling element, comprising an area free of the conductive layer, disposed substantially between the first portion and the second portion, and configured to electromagnetically couple the second portion to the feed structure.

A radio frequency device adapted for wireless communications, the radio frequency device comprising:

• a printed circuit board comprising a ground plane, a feed structure, and an antenna apparatus for enabling at least a portion of the wireless communications, the antenna apparatus comprising:
• a dielectric substrate comprising a plurality of surfaces;
• a first antenna element disposed at least partially on a first surface of said substrate, the first antenna element connected to the a feed structure at a first location;
• a second antenna element disposed at least partially on the first surface, the second antenna element coupled to the ground plane at least at a second location;
• and
• an electromagnetic coupling element disposed at least partly between the first antenna element and the second antenna element and configured to electromagnetically couple the second antenna element to the feed structure.

A chip component, comprising:

• a dielectric substrate comprising a plurality of surfaces;
• a conductive layer disposed at least partly on a first surface of the substrate and at least partly on a second surface of the substrate, the conductive layer forming a first antenna element and a second antenna element, the first antenna element configured for electrical coupling to a feed structure at a first location, and the second antenna element configured for coupling to a ground plane at a second location;
• and
• an electromagnetic coupling element comprising a conductor-free area, the area disposed substantially between the first antenna element and the second antenna element and configured to electromagnetically couple the second portion to the feed structure.