Semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorToshiki Seshita
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AssigneeKabushiki Kaisha Toshiba
InventorToshiki Seshita
Estimating the term…
According to one embodiment, a semiconductor device includes a body and a semiconductor element. The body includes a semiconductor mount, a first conductor and a second conductor provided on a periphery of the semiconductor mount. The semiconductor element is disposed on the semiconductor mount and includes a first through switching element, a first shunt switching element, a second through switching element, and a second shunt switching element. The first through switching element is connected between a common terminal and a first radio frequency terminal. A first radio frequency current is flowing through the first through switching element via the first conductor. The first shunt switching element is connected to the first radio frequency terminal. The second through switching element is connected between the common terminal and a second radio frequency terminal. The second shunt switching element has one terminal connected to the second radio frequency terminal and another terminal.
A semiconductor device comprising:
Dependencies are inferred from the claim text.