Apparatus and method for frequency generation

A flip chip comprising:

• a die comprising at least one intermediate layer, electronic circuitry of a first oscillator, electronic circuitry of a second oscillator, and a first inductor of the first oscillator;
• wherein the first inductor is disposed on the at least one intermediate layer;
• and
• a package comprising a second inductor of the second oscillator;
• a first surface facing the die and separated from the die by a plurality of solder bumps;
• wherein the second inductor is disposed on the first surface of the package.

An integrated circuit for preventing unwanted oscillation modes, the integrated circuit comprising:

• electronic circuitry of a first oscillator;
• a first inductor configured for use in an LC tank of the first oscillator, wherein the LC tank of the first oscillator comprises a first capacitance;
• electronic circuitry of a second oscillator;
• a second inductor configured for use in an LC tank of the second oscillator, the second inductor being loosely coupled to the first inductor, and wherein the LC tank of the second oscillator comprises a second capacitance;
• an oscillator control module for the second oscillator, the oscillator control module for the second oscillator being configured to switch a third capacitance into the LC tank of the second oscillator when the second oscillator is inactive, wherein switching the third capacitance causes an oscillation mode of the first oscillator to change from a first mode to a second mode.