Heterogeneous integration of harmonic loads and transistor feedback for improved amplifier performance
OwnerJames M. Carroll, John G. Heston +1inventors
InventorsJames M. Carroll, John G. Heston, Jon Edward Mooney
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Abstract
An RF power amplifier device in which the circuit is provided on two separate dies which are attached together vertically. According to one embodiment of the present invention, the RF power amplifier includes a first die including an amplifying circuit for amplifying an RF signal, and a second die including at least one circuit component coupled to the amplifying circuit. The first die is vertically coupled to the second die, and the second die may be a flip chip and include harmonic loads and/or feedback circuit.
Claims15
An RF amplifier comprising:
- a first die comprising an amplifying circuit for amplifying an RF signal;
- and
- a second die comprising at least one circuit component of the RF amplifier electrically coupled to the amplifying circuit, wherein the first die is vertically coupled to the second die.
A method of fabricating an RF amplifier comprising:
- fabricating an amplifying circuit for amplifying an RF signal on a first die;
- fabricating at least one circuit component of the RF amplifier on a second die;
- and
- electrically coupling the at least one circuit component to the amplifying circuit by vertically coupling the second die to the first die.
Dependencies are inferred from the claim text.