Sensing structure of alignment of a probe for testing integrated circuits
AssigneeSTMicroelectronics S.r.l.
InventorAlberto Pagani
Life of this patent
Estimating the term…
Abstract
A sensing structure for use in testing integrated circuits on a substrate. The sensing structure includes at least two sensing regions connectable to a probe and at least one first sensing element. Each of the at least one first sensing elements is directly connected to two sensing regions such that for each sensing region a different value of an electrical parameter is measurable between the sensing region and a first reference potential so as to reliably determine a drift direction of a probe.
Claims19
A sensing structure for use in testing integrated circuits on a substrate, the sensing structure comprising:
- at least two sensing regions connectable to a probe;
- and
- at least one first sensing element;
- wherein each of the at least one first sensing element is directly connected to two sensing regions, such that for each sensing region a different value of an electrical parameter is measurable between said sensing region and a first reference potential so as to determine a drift direction of the probe.
A substrate for integrated circuits, comprising:
- at least one sensing structure for use in testing integrated circuits on a substrate, the sensing structure comprising:
- at least two sensing regions connectable to a probe;
- and
- at least one first sensing element;
- wherein each of the at least one first sensing element is directly connected to two sensing regions, such that for each sensing region a different value of an electrical parameter is measurable between said sensing region and a first reference potential so as to determine a drift direction of the probe.
Dependencies are inferred from the claim text.