Method for Manufacturing a Piezoelectric Device and the Same

A method for manufacturing a piezoelectric device having a piezoelectric vibrating piece and a package base, the method comprising the steps of:

• providing a base wafer of glass or piezoelectric material;
• forming an anticorrosive film on a first surface and on a second surface opposing the first surface of the base wafer;
• forming a photoresist layer on the anticorrosive film;
• exposing the photoresist layer to define the outlines of the package base on the base wafer after the forming step and the photoresist layer is removed for metal-etching,
• metal-etching the anticorrosive film corresponding to the through-hole, after the exposing step;
• applying an etching solution to the glass or the piezoelectric material and wet-etching the first surface and the second surface of the base wafer until before completely cutting through the glass or the piezoelectric material, after the metal-etching step;
• and
• sand-blasting an abrasive from the second surface side of the base wafer, with the anticorrosive film remaining in place on said second surface.