Integrated circuit packaging system with die paddles and method of manufacture thereof

A method of manufacture of an integrated circuit packaging system comprising:

• forming a package paddle group having a first package paddle electrically isolated from a second package paddle by a gap;
• attaching an integrated circuit device on the first package paddle and the second package paddle;
• forming a standoff terminal adjacent the package paddle group and electrically connected to the integrated circuit device;
• connecting a paddle connector to the integrated circuit device and the first package paddle and another paddle connector to the integrated circuit device and the second package paddle;
• and
• forming an encapsulation over the integrated circuit device, the first package paddle, the second package paddle, and the standoff terminal, the encapsulation exposing a portion of the first package paddle, the second package paddle, and the standoff terminal.

An integrated circuit packaging system comprising:

• a package paddle group having a first package paddle electrically isolated from a second package paddle;
• an integrated circuit device on the first package paddle and the second package paddle;
• a standoff terminal adjacent the package paddle group and electrically connected to the integrated circuit device;
• a paddle connector connected to the integrated circuit device and the first package paddle and another paddle connector connected to the integrated circuit device and the second package paddle;
• and
• an encapsulation over the integrated circuit device, the first package paddle, the second package paddle, and the standoff terminal, a portion of the first package paddle, the second package paddle, and the standoff terminal exposed from the encapsulation.