US 2012/0068356 A1 · Component having a VIA

Abstract

A component having a via includes: (i) a first layer having a first via portion, a first trench structure, and a first surrounding layer portion, the first via portion being separated by the first trench structure from the first surrounding layer portion; (ii) a second layer having a second via portion, a second trench structure, and a second surrounding layer portion, the second via portion being separated by the second trench structure from the second surrounding layer portion; (iii) an insulation layer disposed between the first and the second layer, the insulation layer having an opening so that the first and the second via portions of the first and the second layers are directly connected to one another in the region of the opening. The first via portion and the second surrounding layer portion at least partially overlap.

Claims12

Dependent claims

A component having a via, comprising:

a first layer having a first via portion, a first trench structure, and a first surrounding layer portion, wherein the first via portion is separated by the first trench structure from the first surrounding layer portion;
a second layer having a second via portion, a second trench structure, and a second surrounding layer portion, wherein the second via portion is separated by the second trench structure from the second surrounding layer portion;
and
an insulation layer disposed between the first and the second layer, wherein the insulation layer has an opening so that the first and the second via portions of the first and the second layers are directly connected to one another in the region of the opening;
wherein the first via portion of the first layer and the second surrounding layer portion of the second layer are disposed overlappingly with one another at least in a sub-region.

2 more elements

Dependencies are inferred from the claim text.

Component having a VIA

Life of this patent

Component having a VIA

Life of this patent

Abstract

Claims12