Semiconductor Device and Method of Forming Dam Material With Openings Around Semiconductor Die for Mold Underfill Using Dispenser and Vacuum Assist

A method of making a semiconductor device, comprising:

• providing a semiconductor wafer containing a plurality of semiconductor die;
• forming a dam material around each of the semiconductor die;
• forming a plurality of openings in the dam material;
• singulating the semiconductor wafer to separate the semiconductor die;
• mounting the semiconductor die to a substrate;
• depositing a mold underfill through a first opening in the dam material;
• and
• drawing a vacuum on a second opening in the dam material to spread the underfill material over an area between the semiconductor die and substrate.

A method of making a semiconductor device, comprising:

• providing a semiconductor die;
• forming a dam material around the semiconductor die;
• forming a plurality of openings in the dam material;
• mounting the semiconductor die to a substrate;
• depositing a mold underfill through a first opening in the dam material;
• and
• drawing a vacuum on a second opening in the dam material to spread the underfill material over an area between the semiconductor die and substrate.

A semiconductor device, comprising:

• a substrate;
• a semiconductor die mounted to the substrate;
• a dam material formed around the semiconductor die;
• a plurality of openings formed in the dam material;
• a dispenser in fluid communication with a first opening in the dam material for depositing a mold underfill through the first opening;
• and
• a vacuum in fluid communication with a second opening in the dam material for drawing the underfill material over an area between the semiconductor die and substrate.