Semiconductor packages, electronic devices and electronic systems employing the same
AssigneeSamsung Electronics Co., Ltd.
InventorsTong-Suk Kim, Woo-Jae Kim, Yun-Seok Choi, Seon-Hyang You
Life of this patent
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Abstract
A semiconductor package, an electronic device, and an electronic system employing the same are provided. The semiconductor package includes a printed circuit board (PCB) and a semiconductor chip structure. A first PCB land region is provided on a first surface of the PCB. A plurality of first chip land regions are provided on a first surface of the semiconductor chip structure which faces the first surface of the PCB. A first connection structure for electrically connecting the first PCB land region to the plurality of first chip land regions is provided.
Claims20
An electronic device, comprising:
- a package substrate having a first surface and having a first lower region and a second lower region provided on the first surface;
- a semiconductor chip structure having a first surface disposed to face the first surface of the package substrate and having a plurality of first upper regions and a second upper region provided on the first surface of the semiconductor chip structure;
- a first connection structure and a second connection structure disposed between the first surface of the package substrate and the first surface of the semiconductor chip structure,
- wherein the first lower region is connected to the plurality of the first upper regions by the first connection structure,
- wherein the second lower region is connected to the second upper region by the second connection structure.
A semiconductor package structure, comprising:
- an electronic device as a first semiconductor package, the electronic device comprising:
- a lower substrate having a first surface and a first lower region provided on the first surface,
- an upper substrate having a first semiconductor chip and a first surface disposed to face the first surface of the lower substrate and having a plurality of first upper regions provided on the first surface of the upper substrate, and
- a connection structure disposed between the first surfaces of the lower and upper substrates to electrically connect the first lower region to the plurality of first upper regions;
- a second semiconductor package having a second semiconductor chip to be connected to the first semiconductor package;
- and
- another connection structure to connect the second semiconductor package to another lower region of the first surface of the lower substrate.
An electronic device comprising:
- a lower substrate having a first surface and having a first lower region, a second lower region, and a third lower region which are provided on the first surface,
- an upper substrate having a first surface disposed to face the first surface of the lower substrate, and having a plurality of first upper regions to correspond to the first lower region, a second upper region to correspond to the second lower region, and a third upper region which are provided on the first surface of the upper substrate,
- a first connection structure disposed to electrically connect the first lower region to the plurality of first upper regions;
- a second connection structure disposed to electrically connect the second lower region to the second upper region;
- and
- a third connection structure disposed to electrically connect the third lower region to an external semiconductor package structure.
Dependencies are inferred from the claim text.