Tape package
AssigneeSamsung Electronics Co., Ltd.
InventorsDong-han Kim, So-young Lim
Life of this patent
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Abstract
A tape package providing a plurality of input and output portions each having a minimum pitch. The tape package includes a tape wiring substrate including first and second wirings, and a semiconductor chip mounted on the tape wiring substrate, and including a first edge, a first pad disposed adjacent to the first edge, and a second pad disposed to be farther spaced apart from the first edge than the first pad, where the first wiring is connected to a portion of the first pad that is spaced from the first edge by a first distance, and where the second wiring is connected to a portion of the second pad that is spaced from the first edge by a second distance that is greater than the first distance.
Claims34
A tape package comprising:
- a tape wiring substrate including first and second wirings;
- and
- a semiconductor chip mounted on the tape wiring substrate including a first edge, a first pad disposed adjacent to the first edge, and a second pad disposed to be farther spaced apart from the first edge than the first pad,
- wherein the first wiring is connected to a portion of the first pad that is spaced from the first edge by a first distance,
- wherein the second wiring is connected to a portion of the second pad that is spaced from the first edge by a second distance that is greater than the first distance.
A tape package comprising:
- a tape wiring substrate including one or more first wirings and one or more second wirings;
- and
- a semiconductor chip mounted on the tape wiring substrate, and comprising a first edge, one or more first pads arranged in a first row to be disposed adjacent to and spaced from the first edge by a first distance, and one or more second pads arranged in a second row to be spaced apart from the first edge by a second distance that is greater than the first distance,
- wherein each of the first wirings is connected to a portion of each of the first pads spaced by the first distance from the first edge,
- wherein each of the second wirings is connected to a portion of each of the second pads spaced by the second distance from the first edge.
A tape package comprising:
- a tape wiring substrate including one or more input wirings, one or more first output wirings, and one or more second output wirings;
- and
- a semiconductor chip mounted on the tape wiring substrate including a first edge, input pads respectively connected to the input wirings, one or more first output pads arranged in a first row to be disposed adjacent to the first edge, and one or more second output pads arranged in a second row to be farther spaced from the first edge than the first output pads,
- wherein each of the first output wirings is connected to a portion of each of the first output pads that are spaced at a first distance from the first edge,
- wherein each of the second output wirings is connected to a portion of each of the second output pads that are spaced at a second distance from the first edge that is greater than the first distance.
A tape package comprising:
- a tape wiring substrate including first and second wirings;
- a semiconductor chip mounted on the tape wiring substrate, the semiconductor chip having a first edge;
- a first pad disposed on the semiconductor chip so as to be centered on a first axis and spaced from the first edge by a first distance, the first pad coupled to the first wiring;
- and
- a second pad disposed on the semiconductor chip so as to be centered on the first axis and to be spaced from the first edge by a second distance that is greater than the first distance, the second pad coupled to the second wiring.
A tape package comprising:
- a tape wiring substrate including first and second wirings;
- a semiconductor chip mounted on the tape wiring substrate, the semiconductor chip having a first edge;
- a plurality of first pads disposed on the semiconductor chip so as to be respectively centered on a plurality of axes that are parallel to one another, the plurality of first pads being spaced from the first edge by a first distance, and each of the plurality of first pads coupled to the first wirings;
- and
- a plurality of second pads disposed on the semiconductor chip so as to be respectively centered on the plurality of axes and to be spaced from the first edge by a second distance that is greater than the first distance, and each of the plurality of second pads coupled to the second wirings.
Dependencies are inferred from the claim text.