Structure for nano-scale metallization and method for fabricating same
AssigneeInternational Business Machines Corporation
InventorsSHOM PONOTH, David V. Horak, Elbert E. Huang, Sivananda K. Kanakasabapathy, Charles W. Koburger, III, Chih-Chao Yang
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Abstract
A method for forming structure aligned with features underlying an opaque layer is provided for an interconnect structure, such as an integrated circuit. In one embodiment, the method includes forming an opaque layer over a first layer, the first layer having a surface topography that maps to at least one feature therein, wherein the opaque layer is formed such that the surface topography is visible over the opaque layer. A second feature is positioned and formed in the opaque layer by reference to such surface topography.
Claims20
A method of forming a structure aligned with features underlying an opaque layer, the method comprising:
- forming an opaque layer over a first layer, said first layer having a surface topography that maps to at least one first feature embedded therein, the opaque layer formed such that said surface topography is visible over said opaque layer;
- positioning at least one second feature in or above said opaque layer by reference to said topography.
A method to form metal interconnects on substrate, said substrate including a top layer having at least one conductive element within dielectric material, the method comprising:
- selectively removing a portion of said dielectric material to define at least one topographic feature and a surface topography on the surface of said top layer;
- and
- forming a metal layer having substantially the same surface topography over said top layer.
An interconnect structure comprising:
- at least two layers on a substrate, said layers comprising metal interconnect structure embedded within dielectric material, each of said layers having at least one via that extends to the top of said layer and at least one line formed along the bottom of said layer,
- wherein said at least one via of the lower of said layers extends into the upper of said layers.
Dependencies are inferred from the claim text.